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Epitaxial BiFe 0.95 Mn 0.05 O 3 (BFMO) film was deposited on (001)-oriented SrRuO 3 (SRO) coated SrTiO 3 (STO) substrate by radio-frequency (rf) magnetron sputtering. Indium tin oxide (ITO) was grown on BFMO/STO heterojunction to fabricate ITO/BFMO/SRO capacitor for investigating the ferroelectric and photovoltaic properties. The ITO/BFMO/SRO capacitor exhibits large remanent polarizations of 92.2 μC/cm2, 101 μC/cm2 and 109 μC/cm2 measured at 20 V, 25 V and 30 V, respectively. An observed abnormal capacitance–voltage (C–V) curve can be explained based on the ITO/BFMO interface. The calculated capacitance and junction width of ITO/BFMO interface are 105 pF and 32 nm, respectively. Additionally, it is found that photovoltaic effect of the ITO/BFMO/SRO capacitor is mainly attributed to ferroelectric polarization and internal electric field induced by defects. The photocurrent densities coming from ferroelectric polarization and internal field are 36 μA/cm2 and 23 μA/cm2, respectively. The photovoltaic output from the ferroelectric polarization is obviously larger than that from the internal electric field.

Ta (3.3 nm)/ Ni – Al (3.3 nm) integrated films deposited on Si substrates by magnetron sputtering, annealed at various temperatures in a ultra-high vacuum, have been studied as diffusion barrier layers between Cu and Si for application in Cu interconnection. The images of transmission electron microscopy (TEM) prove that the cross-sectional interfaces of Cu / Ta / Ni – Al / Si sample annealed at 600°C are clear and sharp. No Cu –silicide peaks can be found from the X-ray diffraction (XRD) patterns of the 850°C annealed sample, but the sheet resistance of the sample increases abruptly. Moreover, large grooves are found from the image of atomic force microscopy (AFM) for the 850°C annealed sample, implying the failure of the diffusion barrier. The integrated Ta / Ni – Al barrier layer retains thermally stable nature up to at least 800°C, indicating that the Ta / Ni – Al integrated film is an excellent diffusion barrier between Cu and Si .

Polycrystalline Bi 0.975 La 0.025 Fe 0.975 Ni 0.025 O 3 (BLFNO) film is fabricated on Pt / Ti / SiO 2/ Si (111) substrate by sol–gel method. It is found that the well-crystallized BLFNO film is polycrystalline, and the Pt / BLFNO / Pt capacitor possesses good ferroelectric properties with remnant polarization of 74 μC/cm2 at electric field of 833 kV/cm. Moreover, it is also found that the leakage current density of the Pt / BLFNO / Pt capacitor increases with the increase of measurement temperature ranging from 100 to 300 K. The leakage density of the Pt / BLFNO / Pt capacitor satisfies space-charge-limited conduction (SCLC) at higher electric field and shows little dependence on voltage polarity and temperature, but shows polarity and temperature dependence at lower applied electric field. With temperature increasing from 100 to 300 K at lower applied electric field, the most likely conduction mechanism is from Ohmic behavior to SCLC for positive biases, but no clear dominant mechanism for negative biases is shown.