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The impacts of gate bias and device temperature on carrier energy distributions are reported for AlGaN/GaN High Electron Mobility Transistors. The lateral electric field and the average carrier energy are the highest at the end of gate on the gate-drain access side. The number of high energy carriers is the greatest in the semi-ON operating condition, with maximum energies exceeding the activation energy of defects in the AlGaN. There is a significant decrease in the number of very high energy carriers (greater than 2 eV) as the device temperature increases whereas the number of moderately energetic carriers (between 1 to 2 eV) is higher at elevated temperatures.(© 2013 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim) [ABSTRACT FROM AUTHOR]