Search

A thermal conductive structural adhesive (TCSA) plays a crucial role in battery performance and safety. TCSA made of polyurethane (PU) has not only a good thermal conductivity but also good mechanical strength and substrate bonding strength. However, it has to be cost‐effective and easy to be prepared. This work aims to synthesize a series of castor oil‐based PU TCSAs with different amounts of thermal conductive powder using commercially available castor oil polyols, isocyanates, Al2O3, and additives. The shear strength of the TCSA containing 88% thermally conductivity powder reached 5.6 MPa, which was similar to that without the thermal conductivity fillers, but its toughness significantly decreased. Its thermal conductivity was as high as 1.8 W/mK, and it was thermally stable below 270°C. [ABSTRACT FROM AUTHOR]

The rapid progress in miniaturization and integration of semiconductor power devices has made heat dissipation a critical concern in the development of high‐performance semiconductor devices, thereby increasing the demands for the heat transfer efficiency of polymer composites. To address this issue, an efficient three‐dimensional (3D) heat conduction network structure is constructed in the polymer matrix by leveraging the mutual reaction of amino and epoxy groups on the surface of the filler treated by coupling during the melt mixing process, this approach leads to an enhancement in the thermal conductivity of the composites. First, the inert surfaces of graphene nanosheets (EX‐G) and carbon fibers (CF) are coated with polydopamine (PDA) to form active sites. Subsequently, the graphene (EX‐G), alumina (Al2O3), and carbon fiber (CF) are treated with an amine coupling agent (KH550) and epoxy coupling agent (KH560), respectively. Notably, at a filler content of 25 wt%, the thermal conductivity (TC) of the composites increases by approximately 282% compared to pure nylon 6. This research contributes novel insights into the field of thermally conductive polymer composites. Highlights: The surface of the EX‐G and CF covered by PDA generates active sites.Fillers reduce the interface thermal resistance through chemical bonds.Fillers surface reaction builds a 3D thermal conductive network.3D network structure can significantly improve the TC of composites.Only 25 wt% of hybrid fillers in a 282% increased TC of composites. [ABSTRACT FROM AUTHOR]

Ethylene‐vinyl acetate copolymer (EVA) has been widely used for packaging materials for decades. However, EVA was highly restricted due to the poor thermal stability and anti‐static performance. For enhancing thermal stability and anti‐static performances, a large number of additives were added to EVA, which seriously prejudice the processability and mechanical properties of the polymer. To address this problem, N‐doped reduced graphene oxide@Fe2O3 (RGF) was constructed as a heat and electronic conduction actor in EVA matrix in this work. As as‐prepared RGF composites shown, Fe2O3 particles well dispersed on the surface of RGO sheets, forming a point‐plane three‐dimensional structure. Therefore, the thermal conductivity and volume resistivity of the EVA composites reached 0.58 W/mK and 1.7 × 1010 ohm∙cm at 1.0 wt.% of RGF addition, which shows 284% folds increasement and 7 orders of magnitude decrement than neat EVA. Moreover, the storage modulus and thermal stability of EVA composites at 180°C were also improved. In sum, all those enhancements were attributed to the Fe2O3 particles well dispersed on RGO sheets, and amino groups from RGF provided mass of hydrogen bonds with EVA chains which provide more sites and path for heat and electronic conduction. In this work, RGF composites and its synthesis strategy show potential promising in the highly effective thermal and electrical exchange materials. [ABSTRACT FROM AUTHOR]