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Your search keyword '"Zhang, Xiao-yan"' showing total 90 results
Start Over Author "Zhang, Xiao-yan" Publisher trans tech publications, ltd.
90 results on '"Zhang, Xiao-yan"'

2. High Performance, Eco-Friendly SPM Cleaning Technology Using Integrated Bench-Single Wafer Cleaning System

Author

Bruce W. Lee, Fang Li, Sally Ann Henry, She Na Jia, Fu Ping Chen, Tao Zhang, Hong Li, Chung Wei Wang, David H. Wang, Yi Yang, Wen Jun Wang, Jun Huang, Hai Bo Lei, Zhang Xiao-Yan, Jane Wang, Yunho Kim, Jason Lee, and Zhang Yu Yu

Subjects
Hardware_MEMORYSTRUCTURES, Materials science, business.industry, General Materials Science, Wafer, Condensed Matter Physics, Process engineering, business, Environmentally friendly, Atomic and Molecular Physics, and Optics
Abstract

Batch SPM systems do not meet the current clean specification/requirements below 28nm. Single wafer SPM systems use a high volume of chemistry which runs to drain, while meeting the cleaning specifications below 28nm. The work in this paper describe the use of a batch SPM system and a single wafer clean in an integrated system, Ultra-C Tahoe which results in meeting the technical specification and using less that 80% of the SPM chemistry used in single wafer systems. The data collected shows this new system meet the specifications, whilst saving more than 80%of SPM chemistry.

Published
2021
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3. Damage-Free Cleaning of Advanced Structure Using Timely Energized Bubble Oscillation Megasonic Technology

Author

Hai Bo Lei, Xi Wang, Fu Ping Chen, Li Hua Ni, Feng Liu, Kwang Kee Chae, Zhen Ming Chu, Fu Fa Chen, Zhang Xiao-Yan, Yu Zhang, Yang Chen, David H. Wang, Ye Fang Zhu, Fang Li, Tao Zhang, and Sally Ann Henry

Subjects
010302 applied physics, Materials science, Bubble oscillation, Acoustics, 0103 physical sciences, General Materials Science, 02 engineering and technology, 021001 nanoscience & nanotechnology, 0210 nano-technology, Condensed Matter Physics, 01 natural sciences, Atomic and Molecular Physics, and Optics
Abstract

The use of highly corrosive chemicals to remove nano-particles on the surface of the wafer, results in substrate losses. This has resulted in the use of megasonics which provides acoustic cavitation to remove small particles. The megasonic wave does generate bubble cavitation which applies mechanical force to wafer structure, the violent cavitation such as transit cavitation or micro jet will damage the patterned structures [1,2]. A new megasonic technology is proposed in this paper, this technology provides stable control of bubble cavitation, without pattern damage at the different modes. The technology shows better particle performance when compared with the industry standard two-fluid nozzle cleaning technology. This Timely Energized Bubble Oscillation mode provides stable cavitation with a wide power window. It is unlike conventional megasonic which creates transit cavitation and damage when the bubble implodes. This new megasonic technology can be used to clean “sensitive” structures at 28nm and below without any pattern damage.

Published
2018
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4. High Performance, Eco-Friendly SPM Cleaning Technology Using Integrated Bench-Single Wafer Cleaning System

Author

Chen, Fu Ping, primary, Lei, Hai Bo, additional, Zhang, Xiao Yan, additional, Wang, Wen Jun, additional, Jia, She Na, additional, Wang, Jane, additional, Lee, Jason, additional, Kim, Y.Y., additional, Lee, Bruce, additional, Henry, Sally Ann, additional, Wang, David H., additional, Yu, Zhang Yu, additional, Zhang, Tao, additional, Huang, Jun, additional, Li, Fang, additional, Wang, Chung Wei, additional, Li, Hong, additional, and Yang, Yi, additional

Published
2021
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5. Damage-Free Cleaning of Advanced Structure Using Timely Energized Bubble Oscillation Megasonic Technology

Author

Wang, David H., primary, Chen, Fu Ping, additional, Zhang, Xiao Yan, additional, Wang, Xi, additional, Chen, Fu Fa, additional, Henry, Sally Ann, additional, Chae, Kwang Kee, additional, Chu, Zhen Ming, additional, Liu, Feng, additional, Chen, Yang, additional, Lei, Hai Bo, additional, Ni, Li Hua, additional, Zhang, Yu, additional, Zhu, Ye Fang, additional, Li, Fang, additional, and Zhang, Tao, additional

Published
2018
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6. Removal of Fine Particle Using SAPS Technology and Functional Water

Author

David H. Wang, Fu Ping Chen, Dong Joo Kim, Jeong Yun Lee, Yue Ma, Geun Min Choi, Xi Wang, Liang Zhi Xie, Zhang Xiao-Yan, Pyo Leem, and Ju Young Lee

Subjects
Materials science, business.industry, Semiconductor device fabrication, Yield (chemistry), Particle, Wet cleaning, General Materials Science, Condensed Matter Physics, Process engineering, business, Dissolution, Atomic and Molecular Physics, and Optics
Abstract

Space alternated phase shift (SAPS) megasonic technology incorporating with functional water, with dissolving gases H2 or N2, was applied to remove fine particle in wet cleaning processes of semiconductor manufacturing in this study. The performances of particle removal were investigated quantitatively by varying the parameters of functional water and megasonic energy. The optimized cleaning performance was further proved with significant yield improvement of mass production by comparison with other main cleaning technology.

Published
2012
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