8 results on '"LINDNER, PAUL"'
Search Results
2. (Invited) High Accuracy Aligned Wafer Bonding for Wafer-Level Integration
3. Wafer Bonding for Backside Illuminated Image Sensors
4. Low Temperature Bonding with Thin Wafers for 3D Integration
5. Plasma Activated Wafer Bonding of Silicon: In Situ and Ex Situ Processes
6. Adhesive Wafer Bonding with SU-8 Intermediate Layers for Microfluidic Applications
7. Plasma Activated Wafer Bonding as an Alternative to Standard Wafer Bonding Processes
8. Plasma Activated Wafer Bonding of Silicon: in Situ and Ex Situ Processes
Catalog
Books, media, physical & digital resources
Discovery Service for Jio Institute Digital Library
For full access to our library's resources, please sign in.