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Start Over Author "Byung-Ho Jun" Publisher the electrochemical society
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1. Rapid Thermal Reduction of Inkjet Printed Cu Interconnects on Glass Substrate

Author

Jin-A Jeong, Dong-Hoon Kim, Hyun Hwi Lee, Jae Bon Koo, Byung-Ho Jun, Han-Ki Kim, In-Kyu Yoo, Sung Eun Kim, and Kang-Heon Hur

Subjects
Reduction (complexity), Materials science, Chemical engineering, General Chemical Engineering, Thermal, Electrochemistry, General Materials Science, Substrate (printing), Electrical and Electronic Engineering, Physical and Theoretical Chemistry
Published
2011
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