1. The Role of Au/Sn Solder in Packaging
- Author
-
H. Oppermann
- Subjects
Interconnection ,Computer science ,business.industry ,Design flow ,Electrical engineering ,Integrated circuit ,law.invention ,Footprint (electronics) ,System in package ,law ,visual_art ,Hybrid system ,Electronic component ,visual_art.visual_art_medium ,business ,Flip chip - Abstract
Packaging is commonly known as a process to protect a single integrated circuit from the environment and to connect the electrical terminals to the printed circuit board. With increasing demands for miniaturisation and higher performance, technologies for system in package (SiP) and hybrid system integration become more important. To address the interaction of package, integrated passive components and active ICs co-design methods have to be implemented into the design flow. In order to achieve the desired system functionality different semiconductor technologies have to be combined, e.g. digital, analogue, RF, MEMS, and optoelectronics. This adds new challenges as higher level design and test capability, but also for hybrid system integration. Flip chip is a key technology for higher hybrid integration as it provides smallest footprint area and also, due to the short interconnection, lower parasitic for higher frequency applications.
- Published
- 2006