14 results on '"Wang, Fengjiang"'
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2. In or Ni addition on mechanical properties and interfacial growth in Sn–35Bi–1Ag solder joint during isothermal aging
3. Effect of trace Ge on interfacial reaction and shear strength of Sn-0.7Cu solder joints during isothermal aging and thermal cycling
4. Thermomigration behavior of Sn–Bi joints under different substrate
5. Microstructural Coarsening and Mechanical Properties of Eutectic Sn-58Bi Solder Joint During Aging
6. Improving the electrical and mechanical performances of embedded capacitance materials by introducing tungsten disulfide nanoflakes into the dielectric layer
7. Wettability, Interfacial Behavior and Joint Properties of Sn-15Bi Solder
8. Recent progress on the development of Sn–Bi based low-temperature Pb-free solders
9. Electromigration behaviors in Sn–58Bi solder joints under different current densities and temperatures
10. Microstructure, interfacial reactions and mechanical properties of Co/Sn/Co and Cu/Sn/Cu joints produced by transient liquid phase bonding
11. Interfacial behavior and joint strength of Sn–Bi solder with solid solution compositions
12. Interfacial evolution in Sn–58Bi solder joints during liquid electromigration
13. Effect of Sn-Ag-Cu on the Improvement of Electromigration Behavior in Sn-58Bi Solder Joint
14. Effect of indium addition on interfacial IMC growth and bending properties of eutectic Sn–0.7Cu solder joints
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