9 results on '"Tu, K. N."'
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2. Interfacial Reactions and Electromigration in Flip-Chip Solder Joints
3. Stress analysis of spontaneous Sn whisker growth
4. Metallurgical Factors
5. Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration in Flip-Chip Sn-0.7Cu Solder Joints
6. Silicide Contact and Gate in Microelectronic Devices
7. Reactions of Thin Metal Films with Si or SiO2 Substrates
8. Residual Damage in Silicon Implanted and Post-Annealed Silicon
9. Stress analysis of spontaneous Sn whisker growth
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