44 results on '"Lau, John H."'
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2. Static and Dynamic Analyses of Surface Mount Component Leads and Solder Joints
3. Study of Low-Temperature Thermocompression Bonding in Ag-In Solder for Packaging Applications
4. A Hermetic Seal Using Composite Thin-Film In/Sn Solder as an Intermediate Layer and Its Interdiffusion Reaction with Cu
5. A Brief Introduction to Fine Pitch Surface Mount Technology
6. Correlation of Analytical and Experimental Approaches to Determination of Thermally Induced Printed Wiring Board (PWB) Warpage
7. Analysis of the Thermal Loading on Electronics Packages by Enhanced Moiré Interferometry
8. Die Stress Measurement Using Piezoresistive Stress Sensors
9. Thermal Stress Considerations in Die-Attachment
10. Mechanics of Wirebond Interconnects
11. Thermal Stress-Induced Open-Circuit Failure in Microelectronics Thin-Film Metallizations
12. Temperature Dependence of Thermal Expansion of Materials for Electronics Packages
13. Transient Thermal Stresses in Multilayered Devices
14. Thermal Stress and Stress-Induced Voiding in Passivated Narrow Line Metallizations on Ceramic Substrates
15. Predicted Bow of Plastic Packages of Integrated Circuit (IC) Devices
16. Corrosion in Microelectronics Packages
17. Thermal Stresses in Anisotropic Multilayered Structures
18. Nonlinear Analysis of a Ceramic Pin Grid Array (PGA) Soldered to an Orthotropic Epoxy Substrate
19. Thermal Expansivity and Thermal Stress in Multilayered Structures
20. Microstructural Evaluation of Sn-Pb Solder and Pd-Ag Thick-Film Conductor Metallization Under Thermal Cycling and Aging Conditions
21. Thermal Stress Issues in Plated-Through-Hole Reliability
22. Solder Creep-Fatigue Interactions with Flexible Leaded Surface Mount Components
23. Solder Joint Reliability of Leadless Chip Carriers
24. A Prediction of the Thermal Fatigue Life of Solder Joints Using Crack Propagation Rate and Equivalent Strain Range
25. Thermal and Moisture Stresses in Plastic Packages
26. Thermomechanical Fatigue of 63Sn-37Pb Solder Joints
27. Solutions to Moisture Resistance Degradation During Solder Reflow of Plastic Surface Mount Components
28. Microstructure and Mechanical Properties of Solder Alloys
29. The Interaction of Creep and Fatigue in Lead-Tin Solders
30. The Role of Microstructure in Thermal Fatigue of Pb-Sn Solder Joints
31. Scanning Electron Microscopy and Energy Dispersive X-ray (SEM/EDX) Characterization of Solder Solderability and Reliability
32. Solder Paste Technology and Applications
33. Post-Solder Cleaning Considerations
34. Optimizing the Wave Soldering Process
35. Technical Considerations in Vapor Phase and Infrared Solder Reflow Processes
36. Flux Reactions and Solderability
37. Modern Approaches to Fatigue Life Prediction of SMT Solder Joints
38. Solder Attachment Reliability, Accelerated Testing, and Result Evaluation
39. Surface Mount Attachment Reliability and Figures of Merit for Design for Reliability
40. Predicting Thermal and Mechanical Fatigue Lives from Isothermal Low Cycle Data
41. A Damage Integral Methodology for Thermal and Mechanical Fatigue of Solder Joints
42. Integrated Matrix Creep: Application to Accelerated Testing and Lifetime Prediction
43. Effects of Strain Range, Ramp Time, Hold Time, and Temperature on Isothermal Fatigue Life of Tin-Lead Solder Alloys
44. Creep and Stress Relaxation in Solder Joints
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