Author: "Gourlay, C.M." / Publisher: springer us - Searchworks@Jio Institute Digital Library Search Results

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Your search keyword '"Gourlay, C.M."' showing total 3 results

Start Over Author "Gourlay, C.M." Publisher springer us

3 results on '"Gourlay, C.M."'

1. Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process

Author: Mohd Salleh, M.A.A., McDonald, S.D., Gourlay, C.M., Belyakov, S.A., Yasuda, H., and Nogita, K.
Published: 2016
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2. Feeding Mechanisms in High-Pressure Die Castings

Author: Otarawanna, S., Laukli, H.I., Gourlay, C.M., and Dahle, A.K.
Published: 2010
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3. The Maximum Fluidity Length of Solidifying Sn-Cu-Ag-Ni Solder Alloys

Author: Gourlay, C.M., Read, J., Nogita, K., and Dahle, A.K.
Published: 2008
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