73 results on '"Tu, K. N."'
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2. Fabrication and characteristics of highly $$\langle {110} \rangle $$-oriented nanotwinned Au films
3. Tuning Stress in Cu Thin Films by Developing Highly (111)-Oriented Nanotwinned Structure
4. Element Effects on High-Entropy Alloy Vacancy and Heterogeneous Lattice Distortion Subjected to Quasi-equilibrium Heating
5. Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient
6. Comparison of oxidation in uni-directionally and randomly oriented Cu films for low temperature Cu-to-Cu direct bonding
7. Suppression of interdiffusion-induced voiding in oxidation of copper nanowires with twin-modified surface
8. Metallurgical challenges in microelectronic 3D IC packaging technology for future consumer electronic products
9. Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration in Flip-Chip Sn-0.7Cu Solder Joints
10. In-situ early stage electromigration study in Al line using synchrotron polychromatic X-ray microdiffraction
11. Electromigration effect on intermetallic growth and Young’s modulus in SAC solder joint
12. Ni implantation-induced enhancement of the crystallisation of amorphous Si
13. Stress analysis of spontaneous Sn whisker growth
14. A synchrotron radiation x-ray microdiffraction study on orientation relationships between a Cu6 Sn5 and Cu substrate in solder joints
15. Synchrotron X-ray Micro-diffraction Analysis on Microstructure Evolution in Sn under Electromigration
16. Morphology Change, Size Distribution, and Nano-sized Channels in Cu6Sn5 Intermetallic Compound Formation at the SnPb Solder and Copper Interface
17. A Study of Impact Reliability of Lead-free BGA Balls on Au/Electrolytic Ni/Cu Bond Pad
18. The application of lead-free solder to optical fiber packaging
19. Formation of nickel disilicide using nickel implantation and rapid thermal annealing
20. Effect of supersaturation of Cu on reaction and intermetallic compound formation between Sn–Cu solder and thin film metallization
21. Influence of substrate metallization on diffusion and reaction at the under-bump metallization/solder interface in flip-chip packages
22. Interfacial Microstructure Evolution Between Eutectic SnAgCu Solder and Al/Ni(V)/Cu Thin Films
23. Stress Relaxation of a Patterned Microstructure on a Diaphragm
24. Electromigration in solder joints and solder lines
25. Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu
26. Morphological stability of solder reaction products in flip chip technology
27. Wetting reaction of Sn-Ag based solder systems on Cu substrates plated with Au and/or Pd layer
28. Synthesis and characterization of porous polymeric low dielectric constant films
29. Effect of current crowding on contact failure in heavily doped n+- and p+-silicon-on-insulator
30. Interfacial Morphology and Shear Deformation of Flip Chip Solder Joints
31. Low-dislocation relaxed SiGe grown on an effective compliant substrate
32. Silicide formation in implanted channels and interfacial reactions of metal contacts under high current density
33. High-temperature lead-free SnSb solders: Wetting reactions on Cu foils and phased-in Cu–Cr thin films
34. Two- and Three-dimensional Arrays of Magnetic Microspheres
35. In situ scanning electron microscopy study of eutectic SnPb and pure Sn wetting on Au/Cu/Cr multilayered thin films
36. A New Low Dielectric Constant Polymer Material (k < 2): Microstructure, Electrical Properties, and Mechanical Properties
37. Size dependent dewetting and sideband reaction of eutectic SnPb on Au/Cu/Cr multilayered thin film
38. Morphology of wetting reactions of SnPb alloys on Cu as a function of alloy composition
39. Grain Growth by Digm in Ni Thin Film Under High Tensile Stress
40. Asymmetrical Heating Behavior at Ni/Doped-Si Junctions for Soi Structures
41. Ultra-Thin TaN Films As Diffusion Barriers For Cu Metallization
42. The Processing and Characterization of Hybrid Silica-Based Xerogel Films
43. Nucleation and Growth of {113} Defects and {111} Dislocation Loops Insilicon-Implanted Selicon
44. Encapsulation of Silver Via Nitridation of Ag/Ti Bilayer Structures
45. Wetting Behaviors of Sn-Based Solders on Cu and Pd Surfaces
46. Crystallographic evolution of microstructure in thin film processing: Part II. Grain boundary structure
47. Nonalloyed Ohmic Contacts to N-Si Using a Strained Si0.5Ge0.5 Buffer Layer
48. Nucleation and Growth kinetics of Cu2O During Reduction of CuO Thin Films
49. Silicide precipitation and silicon crystallization in nickel implanted amorphous silicon thin films
50. Quantitative investigation of titanium/amorphous-silicon multilayer thin film reactions
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