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We have developed a new method to measure the viscosity of micrometric films by thermomechanical analysis with a hemispherical probe of millimetric diameter. The loading curve (displacement vs. time) recorded as the probe tip crosses the whole film at constant load until it touches the substrate is fitted to a theoretical curve shape that has been obtained after solving the problem of liquid flow under the probe tip. The method has been validated by measuring the viscosity of rosin films. It has been applied to analyze the thermal evolution of unstable liquid films that appear on Ba propionate, Ce(III) propionate and a low-fluorine precursor film of YBa2Cu3O6+x. During pyrolysis of the last two films, viscosity first diminishes due to heating and then it increases as solid oxide particles are formed inside the liquid.

We have developed a new method to measure the thermal conductivity of powders by differential scanning calorimetry (DSC) that works with masses in amounts as low as tens of mg. The method is based on that used by Camirand to determine the thermal conductivity of materials in the form of thin sheets but introducing a hemispherical pan to contain powders in such a way that the issue of heat transfer is reduced to a one-dimensional problem. The modification of the method was successfully validated on obtaining identical results in determining the thermal conductivity of a commercial silicone with both Camirand"s method and the modified method. We have also tested our method with materials that, in bulk, cover a wide range of thermal conductivities and have performed the experiments with several atmospheres and reference metals. The results are consistent with already published general trends in that they confirm that thermal conductivity of powders is mainly governed by thermal conduction through the surrounding gas This work was partially funded by the Spanish Programa Nacional de Materiales through projects MAT2011-28874-C02-02 and by the Generalitat de Catalunya contract No. 2009SGR-185