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Thermoelectric power generation technology aims to convert thermal energy into electricity. Micromodule design optimization depends directly on the thermal environment. For low thermal energy input, optimized thermoelectric devices require 100 μm to 500 μm element thickness. These dimensions currently present a challenge for standard mass-production manufacturing techniques. In this paper, a unique printing technology for micromodule fabrication is presented. This technology is compared with a traditional bulk thermoelectric manufacturing process to highlight the advantages of the printing process to obtain scalable thermoelectric devices. Initial thermoelectric materials have been integrated in inks and then deposited by a spray technology onto a polymer substrate. A complete micromodule for application on nonplanar surfaces is also presented.

In major applications, optimal power will be achieved when thermoelectric films are at least 100 μm thick. In this paper we demonstrate that screen-printing is an ideal method to deposit around 100 μm of (Bi,Sb)2(Te,Se)3-based films on a rigid or flexible substrate with high Seebeck coefficient value (90 μV K−1 to 160 μV K−1) using a low-temperature process. Conductive films have been obtained after laser annealing and led to acceptable thermoelectric performance with a power factor of 0.06 μW K−2 cm−1. While these initial material properties are not at the level of bulk materials, the complete manufacturing process is cost-effective, compatible with large surfaces, and affords a mass-production technique.