19 results on '"Lee, Seong Min"'
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2. Advances in Synthetic Biology Tools and Engineering of Corynebacterium glutamicum as a Platform Host for Recombinant Protein Production
3. Mechanism for mitigating filler-induced reliability degradation in semiconductor devices assembled utilizing an LOC package technique
4. Polyion complex micelle formed from tetraphenylethene containing block copolymer
5. Development of antimicrobial polyolefin films containing lauroyl arginate and their use in the packaging of strawberries
6. A study on the efficiency improvement of a passive oil damper using an MR accumulator
7. Application of Paris’s law to thermal cycling-induced failure in semiconductor device patterns
8. Application of Paris’s law to thermal cycling-induced failure in semiconductor device patterns
9. Filler-induced failure mechanism in plastic-encapsulated microelectronic packages
10. Thermomechanical stability of memory package with LOC structure
11. Processing strategies for enhanced resistance to impact fracture of thin small-outline packages
12. Automatic heat-shrink sleeve applicator using the low-temperature catalytic combustor
13. The impact of diamond particles on the susceptibility of silicon chips to flexural fracture
14. Appropriate passivation structure in dynamic random access memory devices to improve stress-related reliability performance after plastic packaging
15. Dependence of Stress-Related Reliability of Metallic Power Line on Physical Properties of Its Overlayer, Chip Location and Package Structure in Memory Devices
16. Reliability Improvement of Passivated Power Line in Memory Devices
17. Effect of hydrogen on the impedance of passivating oxide films formed on aluminium in sodium nitrate solution
18. A critical evaluation of the stress-corrosion cracking mechanism in high-strength aluminum alloys
19. The influence of loading frequency on the fatigue crack propagation behaviour of Al-Zn-Mg alloy at low cyclic stress intensity level in 3.5 wt % NaCl solution
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