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A combined computational-experimental framework is introduced herein to validate numerical simulations at the microscopic scale. It is exemplified for a flat specimen with central hole made of cast iron and imaged via in-situ synchrotron laminography at micrometer resolution during a tensile test. The region of interest in the reconstructed volume, which is close to the central hole, is analyzed by digital volume correlation (DVC) to measure kinematic fields. Finite element (FE) simulations, which account for the studied material microstructure, are driven by Dirichlet boundary conditions extracted from DVC measurements. Gray level residuals for DVC measurements and FE simulations are assessed for validation purposes. [ABSTRACT FROM AUTHOR]

The advent of miniature surface-mount components coupled with increasing lead counts poses tremendous challenges during the assembly of printed circuit boards (PCBs). This is especially true in an electronics manufacturing service (EMS) industry, where the focus has been to increase throughput and first-pass yields at minimum expenditure. Hence, robust inspection systems are required to achieve the objectives of inspecting all the solder joints on a PCB assembly without affecting throughput and of accurately and repeatedly detecting solder-joint-related defects. Conventional inspection technologies are limited in their capability to inspect and detect solder-joint-related defects. However, these limitations have been addressed to a considerable extent by automated 3D laminography x-ray inspection systems. This research effort ascertained the effectiveness of an automated 3D laminography x-ray inspection system from a statistical and assembly perspective. The results of this investigation were analyzed and continuous improvement measures were initiated and employed to improve the performance of the automated 3D laminography x-ray inspection system and, subsequently, of the surface-mount technology (SMT) line. [ABSTRACT FROM AUTHOR]