40 results on '"Zschech, Ehrenfried"'
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2. Materials Characterization by Ellipsometry
3. Electron Backscatter Diffraction: Application to Cu Interconnects in Top-View and Cross Section
4. Thermal Desorption Spectrometry as a Method of Analysis for Advanced Interconnect Materials
5. Advanced Material Characterization by TOFSIMS in Microelectronic
6. Electronic Properties of the Interface Formed by Pr2O3 Growth on Si(001), Si(111) and SiC(0001) Surfaces
7. The Importance of Polymers in Wafer-Level Packaging
8. Challenges to Advanced Materials Characterization for ULSI Applications
9. Packaging Materials: Organic-Inorganic Hybrids for Millimetre-Wave Optoelectronics
10. Organic Nonvolatile Memories
11. Wafer-Level Three-Dimensional Hyper-Integration Technology Using Dielectric Adhesive Wafer Bonding
12. Texture and Stress Study of Sub-Micron Copper Interconnect Lines Using X-ray Microdiffraction
13. Electrically Conductive Adhesives as Solder Alternative: A Feasible Challenge
14. The Role of Au/Sn Solder in Packaging
15. Dielectric and Scaling Effects on Electromigration for Cu Interconnects
16. Carbon Nanotube Via Technologies for Future LSI Interconnects
17. Advanced Barriers for Copper Interconnects
18. Nickel Nanowires Obtained by Template Synthesis
19. Synthesis and Characterization of Compounds Obtained by Crosslinking of Polymethylhydrosiloxane by Aromatic Rings
20. Revealing the Porous Structure of Low-k Materials Through Solvent Diffusion
21. Conductivity Enhancement in Metallization Structures of Regular Grains
22. Stress Modeling for Copper Interconnect Structures
23. Scaling of Ferroelectric-based Memory Concepts
24. Interconnect Technology — Today, Recent Advances and a Look into the Future
25. Amorphous-to-fcc Transition in GeSbTe Alloys
26. Device Concepts with Magnetic Tunnel Junctions
27. Phase-change Memories
28. Floating-dot Memory Transistors on SOI Substrate
29. Ion-beam Synthesis of Nanocrystals for Multidot Memory Structures
30. Silicides — Recent Advances and Prospects
31. An Introduction to Nonvolatile Memory Technology
32. Selective Airgaps: Towards a Scalable Low-k Solution
33. Surface Engineering Using Self-assembled Monolayers: Model Substrates for Atomic-layer Deposition
34. Atomic-layer Deposited Barrier and Seed Layers for Interconnects
35. Pushing PVD to the Limits — Recent Advances
36. Copper CVD for Conformal Ultrathin-film Deposition
37. Thin-film Engineering by Atomic-layer Deposition for Ultra-scaled and Novel Devices
38. LEPECVD — A Production Technique for SiGe MOSFETs and MODFETs
39. Molecular-beam Deposition of High-k Gate Dielectrics for Advanced CMOS
40. TEM Characterization of Strained Silicon
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