1. Monitoring of dimple formation in honeycomb sandwich structures using distributed fiber optic sensors
- Author
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Juho T. Siivola, Kazuya Kitamoto, Shu Minakuchi, Nobuo Takeda, and Tadahito Mizutani
- Subjects
Materials science ,Mechanical Engineering ,Composite number ,02 engineering and technology ,021001 nanoscience & nanotechnology ,Thermal expansion ,020303 mechanical engineering & transports ,0203 mechanical engineering ,Mechanics of Materials ,Dimple ,Fiber optic sensor ,Ceramics and Composites ,Honeycomb ,Composite material ,0210 nano-technology ,Strain monitoring - Abstract
Dimpling in the composite face sheets of honeycomb sandwich structures due to mismatch in the thermal expansion coefficients of the constituent materials was studied with emphasis on its monitoring and prediction. Strain distributions along optical fibers embedded in the face sheet were monitored during manufacturing. Dimple formation and in-plane strain distributions in the face sheets were studied using finite element analysis, and an analytical model based on the beam theory was constructed to predict the dimple depths from the strain data. A system using twin optical fiber sensors was proposed to accurately measure the dimpling-induced strains. The usability and performance of the system was evaluated using small scale specimens and finally on a more realistic large-scale specimen. The system could measure the strain changes due to dimpling of the face sheets and provided decent prediction of the dimple depth distribution along the sandwich panels.
- Published
- 2020
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