Search

Your search keyword '"Packaging Density"' showing total 11 results
Start Over Descriptor "Packaging Density" Publisher reed business information, inc. (us)
11 results on '"Packaging Density"'

2. Resist Ups Density of Additive Boards

Subjects
Circuitry, Integrated Circuits, New Technique, Integrated Circuit Fabrication, Semiconductor Preparation, Coatings, Packaging Density, Boards/Cards
Published
1984

5. Kodak Develops Media for 10M-Byte Floppies

Author

Sehr, R.A.

Subjects
Disk Storage, Floppy Disk Drive, Packaging Density, Perpendicular Recording, Storage Capacity, Thin-Film Recording, Kodak Spin Products -- Research
Published
1983

7. Cyrix, IBM deliver first fruit of partnership

Subjects
Production Control, Microprocessor, Integrated Circuit Fabrication, Packaging Density, Power Dissipation, CMOS, Mass Production, Cyrix Corp. -- Production management, International Business Machines Corp. IBM Microelectronics Div. -- Production management, Cyrix Cx486DX2-V66 (Microprocessor) -- Production management, Cyrix Cx486DX2-V80 (Microprocessor) -- Production management, Microprocessors -- Production management
Published
1994

8. AMD and HP cooperate on new IC process

Subjects
Cooperative Agreements, Product Development, Chip Packaging, Packaging Density, New Technique, Microprocessor, CMOS, Integrated circuit fabrication, Hewlett-Packard Co. -- Product development, Advanced Micro Devices Inc. -- Product development, Microprocessors -- Design and construction, Complementary metal oxide semiconductors -- Design and construction, Integrated circuit fabrication -- Innovations
Published
1993

9. IBM orders compact synchrotron

Author

Fallon, James and Santo, Brian

Subjects
Contracts, Superconductors, Integrated Circuit Fabrication, Packaging Density, Miniaturization, Industry-Sponsored Research, Prototype, Magnetic Devices, International Business Machines Corp. -- Contracts, Oxford Instruments Group PLC -- Contracts
Published
1987

10. CMOS SRAMs to be 1st AMD-Sony product

Subjects
Semiconductor Device, Metal oxide semiconductors, Complementary, RAM, Joint ventures, Static Cell, Cooperative Agreements, Product Development, Miniaturization, Packaging Density, Advanced Micro Devices Inc. -- Product development, Sony Corp. -- Product development
Published
1987

11. Intel informally shows P12 silicon

Subjects
Microprocessor, Processor Architecture, Packaging Density, Product Development, Intel Corp. -- Product development, Intel P12 (Microprocessor) -- Product development
Published
1990

Catalog

Books, media, physical & digital resources
See catalog results