11 results on '"Frieder H. Baumann"'
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2. Development of Ultra-thin TEM Lamella Preparation Technique and Its Application in Failure Analysis
3. Innovative Grounding Methodology for Epoxy Impregnated Semiconductor Cross Sections for Electron Microscopy Inspection
4. Combine TEM with TCAD Simulation - A Novel Approach in Failure Analysis
5. Towards Routine EDX Tomography in Semiconductor Failure Analysis
6. A Case-Study of Bubble Formation Mechanism by Analytical TEM during Evaluation of an Incoming Spin-On-Hardmask at Wafer-Foundries
7. How to Avoid Artifacts in Nanobeam Diffraction Strain Measurements
8. Advances in Elemental Electron Tomography for the State-of-the-art Semiconductor Devices and Circuits Characterization and Failure Analysis
9. Characterization of VLSI Processing Defects Using STEM-EELS Tomography
10. Practical Considerations in Quantitative Nanoscale Energy-Dispersive X-ray Spectroscopy (EDX) and Its Application in SiGe
11. Environmental Optimization for Sub-0.2NM Scanning Transmission Electron Microscopy
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