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We demonstrated electrically injected GeSn laser with the threshold to as low as 353 A/cm2 at 10 K. The threshold reduction was achieved by introducing a thicker SiGeSn cap, eliminating the optical loss from the top metal contact. The peak power was measured as 2.75 mW/facet at 10 K. At 110 K, the emission peak is at 2604 nm.

GeSn lasers enable the monolithic integration of lasers on the Si platform using all-group-IV direct-bandgap material. The GeSn laser study recently moved from optical pumping into electrical injection. In this work, we present explorative investigations of GeSn heterostructure laser diodes with various layer thicknesses and material compositions. Cap layer material was studied by using Si 0.03 Ge 0.89 Sn 0.08 and Ge 0.95 Sn 0.05 , and cap layer total thickness was also compared. The 190 nm SiGeSn-cap device had threshold of 0.6 kA / cm 2 at 10 K and a maximum operating temperature ( T max ) of 100 K, compared to 1.4 kA / cm 2 and 50 K from 150 nm SiGeSn-cap device, respectively. Furthermore, the 220 nm GeSn-cap device had 10 K threshold at 2.4 kA / cm 2 and T max at 90 K, i.e., higher threshold and lower maximal operation temperature compared to the SiGeSn cap layer, indicating that enhanced electron confinement using SiGeSn can reduce the threshold considerably. The study of the active region material showed that device gain region using Ge 0.87 Sn 0.13 had a higher threshold and lower T max , compared to Ge 0.89 Sn 0.11 . The performance was affected by the metal absorption, free carrier absorption, and possibly defect density level. The maximum peak wavelength was measured as 2682 nm at 90 K by using Ge 0.87 Sn 0.13 in gain regions. The investigations provide directions to the future GeSn laser diode designs toward the full integration of group-IV photonics on a Si platform.

Silicon-tin (Si1-xSnx) films have been grown using plasma-enhanced chemical vapor deposition on Si (001) substrate. X-ray photoelectron spectroscopy characterization of the thin films show successful substitutional incorporation of Sn in Si lattice up to 3.2%. The X-ray diffraction characterizations show epitaxial growth of Si1-xSnx films (001) direction. The Sn incorporation has been measured using X-ray photoelectron spectrometry and the film uniformity was confirmed using energy dispersive X-ray spectrometry.

Monolithic lasers on Si have long been anticipated as an enabler of full photonic integration, and significant progress in GeSn material development shows promise for such laser devices. While there are many reports focused on optically pumped lasers, in this work, we demonstrate electrically injected GeSn lasers on Si. We grew a GeSn/SiGeSn heterostructure diode on a Si substrate in a ridge waveguide laser device and tested it under pulsed conditions, giving consideration to the structure design to enhance the carrier and optical confinement. The peak linewidth of 0.13 nm (0.06 meV) and injection current curves indicated lasing, which was observed up to 100 K with emission peaks at 2300 nm. We recorded a threshold of 598 A / c m 2 at 10 K. The peak power and external quantum efficiency were 2.7 mW/facet and 0.3%, respectively. The results indicate advances for group-IV-based lasers, which could serve as a promising route for laser integration on Si.