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Photonic integrated circuits (PICs) can drastically expand the capabilities of quantum and classical optical information science and engineering. PICs are commonly fabricated using selective material etching, a subtractive process. Thus, the chip’s functionality cannot be substantially altered once fabricated. Here, we propose to exploit wide-bandgap non-volatile phase-change materials (PCMs) to create rewritable PICs. A PCM-based PIC can be written using a nanosecond pulsed laser without removing any material, akin to rewritable compact disks. The whole circuit can then be erased by heating, and a new circuit can be rewritten. We designed a dielectric-assisted PCM waveguide consisting of a thick dielectric layer on top of a thin layer of wide-bandgap PCMs Sb2S3 and Sb2Se3. The low-loss PCMs and our designed waveguides lead to negligible optical loss. Furthermore, we analyzed the spatiotemporal laser pulse shape to write the PICs. Our proposed platform will enable low-cost manufacturing and have a far-reaching impact on the rapid prototyping of PICs, validation of new designs, and photonic education.

We present and erratum to our review article [Opt. Mater. Express 12, 2145 (2022)10.1364/OME.456428]. This erratum corrects the references in Table 3, a typo, and a misleading sentence. These corrections do not affect conclusions of the original review article.

Chalcogenide phase change materials (PCMs) are truly remarkable compounds whose unique switchable optical and electronic properties have fueled an explosion of emerging applications in electronics and photonics. Key to any application is the ability of PCMs to reliably switch between crystalline and amorphous states over a large number of cycles. While this issue has been extensively studied in the case of electronic memories, current PCM-based photonic devices show limited endurance. This review discusses the various parameters that impact crystallization and re-amorphization of several PCMs, their failure mechanisms, and formulate design rules for enhancing cycling durability of these compounds.

We report a fully-packaged 3-D integrated photonics platform with devices placed at arbitrary pre-defined locations in 3-D. We further demonstrated the application of the platform to mechanical strain sensing.