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1. Thermal management of chips by a device prototype using synergistic effects of 3-D heat-conductive network and electrocaloric refrigeration

Author

Ming-Ding Li, Xiao-Quan Shen, Xin Chen, Jia-Ming Gan, Fang Wang, Jian Li, Xiao-Liang Wang, and Qun-Dong Shen

Subjects
Science
Abstract

Efficient thermal structure and precise heat management become a substantial challenge for electronics. Here, authors utilize the synergistic effect of classic heat transfer and electrocaloric cooling for fixed-point thermal management of chips.

Published
2022
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