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Start Over Author "Wahab, Juyana A." Publisher mdpi ag
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1. Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy

Author

Roduan, Siti Faqihah, primary, Wahab, Juyana A., additional, Salleh, Mohd Arif Anuar Mohd, additional, Mahayuddin, Nurul Aida Husna Mohd, additional, Abdullah, Mohd Mustafa Al Bakri, additional, Halil, Aiman Bin Mohd, additional, Zaifuddin, Amira Qistina Syamimi, additional, Muhammad, Mahadzir Ishak, additional, Sandu, Andrei Victor, additional, Baltatu, Mădălina Simona, additional, and Vizureanu, Petrica, additional

Published
2022
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