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Multi-wire sawing has emerged as the leading technology in wafer production for a variety of semiconductor materials. This study investigates the process stability and efficiency of conventional semiconductor multi-wire slurry saws in routinely machining translucent, high-density alumina ceramics. The brittle and fine-grained translucent alumina ceramics with extreme hardness and wear resistance represents a major challenge for the process. The alumina ceramic substrates are used for sensor applications, energy storage technology and applications in power electronics. An ideal adaptation of the sawing process parameters to the workpiece properties guarantees the efficiency of the slurry sawing process and the quality of the ceramic wafers. An indicator of the efficiency and cutting ability of the sawing process is the size of the bow of the wire web. The first time was shown that the wire bow can be used for the characterization of the sawing processes for hard and brittle technical ceramics. It was found that a longer workpiece length, a higher number of wafers and stronger abrasive wear lead to an increased size of the bow. The rocking frequency has no measurable influence on the size of the bow. Knowledge of these relations is an extremely valuable tool in the sawing process development for hard and brittle technical ceramics.