1. Robust Packaging of Vertically Aligned Graphite Substrate by Copper Micro-Rib Structuring
- Author
-
Tatsuhiko Aizawa, Hiroki Naka, Takeshi Nasu, and Yoshiro Nogami
- Subjects
graphene base packaging ,micro-grooving ,oxygen plasma etching ,copper wet plating ,rib-structuring ,robustness ,Organic chemistry ,QD241-441 - Abstract
Vertically aligned graphite substrate (VGS)-copper packaging was renowned for improving the robustness against the thermal gradient loading by using micro texturing. The micro-groove array with a line width of 50 μm and a pitch of 100 μm was formed into the VGS by controlling the line depth with the use of fast-rate oxygen plasma etching. Three micro-grooved VGS specimens were wet-plated to fill these microgrooves with copper deposits and to cover the VGS surfaces. The nearly full-deposited VGS-Copper specimens were subjected to a severe thermal transient loading test. The simply Cu-covered package and shallow rib-structured VGS-Cu packages were damaged to delaminate at their interfaces. The VGS-Cu package with the copper rib structure with a height of 50 μm experienced no delamination. This rib-structured VGS-copper package with high rib height had sufficient robustness against the severe thermal transients even with the proof of homogeneous thermal spreading capacity.
- Published
- 2022
- Full Text
- View/download PDF