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This paper investigates the wettability of Kovar alloys with high-borosilicate glass and microscopically analyses the mechanism of wettability and diffusion between Kovar and borosilicate glass. First, Kovar was oxidised at 800 °C for 5, 15, 25, 35, and 60 min to observe the oxide morphology of the Kovar surface layer and to analyse the composition of the oxide layer. To investigate the wetting pattern formations of Kovar and high-borosilicate glass under different wetting temperatures, times, and preoxidation conditions, Kovar and high-borosilicate glass obtained from different oxidation treatments were held at 1060 °C for 20 min for wetting experiments, and the glass–metal wetting interface morphology and elemental distribution were observed using SEM and EDS. The elemental diffusion at the wetting interface between the borosilicate glass and the Kovar with different preoxidation and at the glass spreading boundary was investigated. The longitudinal diffusion of the liquid glass in the metal oxide layer formed a new tight chemical bond of Fe2SiO4, and the lateral diffusion of the liquid glass in the Kovar surface layer formed a black halo. [ABSTRACT FROM AUTHOR]

The low temperature sealing of Kovar alloy to DM305 electronic glass was realized by using lead-free glass solder of the Bi2O3-ZnO-B2O3 system in atmospheric environment. The sealing process was optimized by pre-oxidation of Kovar alloy and low temperature founding of flake glass solder. The effects of sealing temperature and holding time on the properties of sealing joint were studied by means of X-ray diffraction (XRD), scanning electron microscope (SEM), energy dispersive X-ray spectroscopy (EDS), etc. The results showed that the pre-oxidized Kovar alloy and DM305 electronic glass were successfully sealed with flake glass solder at the sealing temperature of 500 °C for 20 min. Meanwhile, the joint interface had no pores, cracks, and other defects, the shear strength was 12.24 MPa, and the leakage rate of air tightness was 8 × 10−9 Pa·m3/s. During the sealing process, element Bi in glass solder diffused into the oxide layer of Kovar alloy and DM305 electronic glass about 1 μm, respectively. [ABSTRACT FROM AUTHOR]