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Cu6Sn5-xAg alloys (x = 0, 3, 6; %, mass fraction) were synthesized using Ag as a dopant through a high-temperature melting technique. The microstructure of the alloy was analyzed using X-ray diffraction (XRD), scanning electron microscopy (SEM), and other equipment, while the hardness of the alloy was measured to investigate the impact of Ag addition on the structure and microstructure of the Cu6Sn5 intermetallic compound. This study explored the influence of varying Ag contents on the properties of Cu6Sn5 intermetallic compounds, with calculations based on first principles revealing the mechanical properties and density of states of η′-Cu6Sn5 and its Ag-doped systems. The results indicated that Cu6Sn5-xAg alloys predominantly existed in three distinct forms, all exhibiting large masses without any impurities or precipitates. First-principle calculations demonstrated that Ag substitution in certain sites suppressed the anisotropy of the Young's modulus of Cu6Sn5, particularly in the Cu1, Cu3, Sn1, and Sn3 positions, while the effect was less significant at the Cu2, Cu4, and Sn2 sites. The introduction of Ag through doping enhanced the covalent bonding within the η′-Cu6Sn5 structure, promoting the formation of a stable (Cu, Ag)6Sn5 structure. [ABSTRACT FROM AUTHOR]

In this study, the interfacial structure and abnormal long-term increase of tensile strength in the interfacial intermetallic compounds (IMCs) between SnAg3Cu0.5 solder and Cu substrates during isothermal aging were investigated. After reflow soldering, the IMC layer at the interface was thin and scallop-type. The interfacial layer became thicker with the increase in aging time. After 200 h of aging at 150 °C, the thickness of the interface gradually increased to 3.93 μm and the interface became smooth. Compared with the unaged Cu-Sn interface, the aged joint interface contained more Cu3Sn. The top of the IMC being reflown was relatively smooth, but became denser and prismatic in shape after 200 h of aging at 150 °C. The tensile strength of the joint, immediately after the reflow, reached 81.93 MPa. The tensile properties of the solder joints weakened and then strengthened as they aged. After 200 h of aging at 150 °C, the tensile strength was 83.86 MPa, which exceeded that of the unaged solder joint interface, because the fracture mode of the solder joints changed during aging. [ABSTRACT FROM AUTHOR]