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In this study, the feasibility and mechanism of Pb2+ and malachite green (MG) adsorption from wastewater using KMnO4-modified bamboo biochar (KBC) was evaluated. The KBC was characterized by SEM–EDS, XRD, FTIR and XPS. The adsorption results for Pb2+ conformed to pseudo-second-order kinetics and the Langmuir model theory. Unlike the case for Pb2+, the Freundlich model better described the adsorption behaviour of MG, indicating that adsorption occurred within multiple molecular layers. Both pseudo-first-order kinetics and pseudo-second-order kinetics fit the MG adsorption data well, indicating that physical adsorption was involved in the adsorption process. In addition, the maximum adsorption capacity for Pb2+/MG was 123.47/1111.11 mg·g−1, KBC had high adsorption capacities for Pb2+ and MG, and the mechanisms of Pb2+ adsorption were mineral precipitation, functional group complexation, and cation-π interactions, while the main mechanisms for MG adsorption were pore filling, π–π interactions, and functional group complexation. In this study, KMnO4-modified biochar was prepared and used as an efficient adsorbent, and showed good application prospects for treatment of wastewater containing MG and Pb2+. [ABSTRACT FROM AUTHOR]

The purpose of this work is to investigate the effects of copper (II) sulfate on the formaldehyde release and the mechanical properties of urea formaldehyde (UF) adhesive. Copper (II) sulfate has been used as a formaldehyde scavenger in UF resin, and its effects on the physical and chemical properties of UF adhesive have been studied. Moreover, the mechanical properties and formaldehyde release of plywood prepared with modified UF resin have been determined. The UF resin has been characterized by Fourier-transform infrared (FTIR) spectroscopy and thermogravimetric analysis (TGA). FTIR spectra showed that the addition of copper (II) sulfate to the UF resin does not affect the IR absorptions of its functional groups, implying that the structure of UF is not modified. Further results showed that the free formaldehyde content of the UF resin incorporating 3% copper (II) sulfate was 0.13 wt.%, around 71% lower than that of the untreated control UF adhesive. With a copper (II) sulfate content of 3%, the formaldehyde release from treated plywood was 0.74 mg·L−1, around 50% lower than that from the control UF adhesive, and the bonding strength reached 1.73 MPa, around 43% higher than that of the control. [ABSTRACT FROM AUTHOR]

The purpose of this work is to investigate the effects of copper (II) sulfate on the formaldehyde release and the mechanical properties of urea formaldehyde (UF) adhesive. Copper (II) sulfate has been used as a formaldehyde scavenger in UF resin, and its effects on the physical and chemical properties of UF adhesive have been studied. Moreover, the mechanical properties and formaldehyde release of plywood prepared with modified UF resin have been determined. The UF resin has been characterized by Fourier-transform infrared (FTIR) spectroscopy and thermogravimetric analysis (TGA). FTIR spectra showed that the addition of copper (II) sulfate to the UF resin does not affect the IR absorptions of its functional groups, implying that the structure of UF is not modified. Further results showed that the free formaldehyde content of the UF resin incorporating 3% copper (II) sulfate was 0.13 wt.%, around 71% lower than that of the untreated control UF adhesive. With a copper (II) sulfate content of 3%, the formaldehyde release from treated plywood was 0.74 mg·L -1 , around 50% lower than that from the control UF adhesive, and the bonding strength reached 1.73 MPa, around 43% higher than that of the control.