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X-ray computed tomography (CT) imaging technology has become an indispensable diagnostic tool in clinical examination. However, it poses a risk of ionizing radiation, making the reduction of radiation dose one of the current research hotspots in CT imaging. Sparse-view imaging, as one of the main methods for reducing radiation dose, has made significant progress in recent years. In particular, sparse-view reconstruction methods based on deep learning have shown promising results. Nevertheless, efficiently recovering image details under ultra-sparse conditions remains a challenge. To address this challenge, this paper proposes a high-frequency enhanced and attention-guided learning Network (HEAL). HEAL includes three optimization strategies to achieve detail enhancement: Firstly, we introduce a dual-domain progressive enhancement module, which leverages fidelity constraints within each domain and consistency constraints across domains to effectively narrow the solution space. Secondly, we incorporate both channel and spatial attention mechanisms to improve the network's feature-scaling process. Finally, we propose a high-frequency component enhancement regularization term that integrates residual learning with direction-weighted total variation, utilizing directional cues to effectively distinguish between noise and textures. The HEAL network is trained, validated and tested under different ultra-sparse configurations of 60 views and 30 views, demonstrating its advantages in reconstruction accuracy and detail enhancement. [ABSTRACT FROM AUTHOR]

The interior problem, a persistent ill-posed challenge in CT imaging, gives rise to truncation artifacts capable of distorting CT values, thereby significantly impacting clinical diagnoses. Traditional methods have long struggled to effectively solve this issue until the advent of supervised models built on deep neural networks. However, supervised models are constrained by the need for paired data, limiting their practical application. Therefore, we propose a simple and efficient unsupervised method based on the Cycle-GAN framework. Introducing an implicit disentanglement strategy, we aim to separate truncation artifacts from content information. The separated artifact features serve as complementary constraints and the source of generating simulated paired data to enhance the training of the sub-network dedicated to removing truncation artifacts. Additionally, we incorporate polar transformation and an innovative constraint tailored specifically for truncation artifact features, further contributing to the effectiveness of our approach. Experiments conducted on multiple datasets demonstrate that our unsupervised network outperforms the traditional Cycle-GAN model significantly. When compared to state-of-the-art supervised models trained on paired datasets, our model achieves comparable visual results and closely aligns with quantitative evaluation metrics. [ABSTRACT FROM AUTHOR]

Poor chip solder joints can severely affect the quality of the finished printed circuit boards (PCBs). Due to the diversity of solder joint defects and the scarcity of anomaly data, it is a challenging task to automatically and accurately detect all types of solder joint defects in the production process in real time. To address this issue, we propose a flexible framework based on contrastive self-supervised learning (CSSL). In this framework, we first design several special data augmentation approaches to generate abundant synthetic, not good (sNG) data from the normal solder joint data. Then, we develop a data filter network to distill the highest quality data from sNG data. Based on the proposed CSSL framework, a high-accuracy classifier can be obtained even when the available training data are very limited. Ablation experiments verify that the proposed method can effectively improve the ability of the classifier to learn normal solder joint (OK) features. Through comparative experiments, the classifier trained with the help of the proposed method can achieve an accuracy of 99.14% on the test set, which is better than other competitive methods. In addition, its reasoning time is less than 6 ms per chip image, which is in favor of the real-time defect detection of chip solder joints. [ABSTRACT FROM AUTHOR]