322 results on '"Suzuki, Ken"'
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2. Molecular Dynamics Analysis on the degradation of the crystallinity of a grain boundary under creep loading at elevated temperature.
3. Effect of Strain Rate on the Creep-Fatigue Damage of Ni-Base Superalloy at Elevated Temperatures
4. Molecular Dynamics Analysis on the Degradation of the Strength of a Grain Boundary in Ni-base Superalloy Caused by Accumulation of Atomic-Scale Defects
5. Non-destructive inspection of the change of the microstructure in Ni-base superalloy in the air by using reflectance spectrum analysis of visible light
6. Fundamental Study on the Mechanism of Intergranular Cracking in Polycrystalline Ni-Based Superalloys by using Molecular Dynamics Analysis
7. Acceleration mechanism of Intergranular Cracking of SUS316L under Creep-Fatigue Loading at Elevated Temperatures
8. Development of the generic technologies for a dumbbell graphene nanoribbon-base gas detecting sensor by using strain-induced change of the adsorption and desorption properties of gas molecules
9. Crystallinity-Induced Acceleration of Intergranular Cracking in Thin-Film Interconnections under High Current Density
10. First-principles calculation on the uniaxial-strain-induced change of the adsorption behavior of gas molecules on graphene
11. Evaluation of the Large Deformability of Area-arrayed Carbon-Nanotube-Bundle structures
12. Effect of Precipitation of δ-Phase on the Strength of Grain Boundaries in Ni-Base Superalloy GH4169 at Elevated Temperatures
13. First principle analysis on the strain dependence of the electronic properties of dumbbell-shape graphene nanoribbons
14. Acceleration mechanism of Intergranular Cracking of SUS316L under Creep-Fatigue Loading at Elevated Temperatures
15. Microtexture Dependence of Mechanical and Electrical Properties of Electroplated Gold Thin Films Used for Micro Bumps of 3D Modulus
16. Intergranular Cracking Mechanism of the Stainless Steel SUS316LN under Creep Loading at Elevated Temperature
17. Non-destructive damage evaluation of Ni-base heat-resisted alloy in the air by spectrum analysis of the reflected visible light
18. Degradation Mechanism of Nickel-Based Superalloy 625 Under Creep Loadings at Elevated Temperatures
19. Degradation Mechanism of the Strength of a Grain Boundary of Ni-base Alloy 617 under Creep Loading at Elevated Temperature
20. Non-destructive Evaluation of Precipitation of NbC in Alloy 625 around Grain Boundaries under Creep Loading at Elevated Temperature
21. Crystallinity-Induced Acceleration of Intergranular Cracking in Thin-Film Interconnections under High Current Density
22. Micro-texture Dependence of the Mechanical Properties of Electroplated Gold Thin Films Used for Fine Bumps in 3D Semiconductor Modules
23. Pressure Distribution Sensor using Area-arrayed Carbon Nanotube Bundles
24. Development of a Strain-controlled Graphene-based Highly Sensitive Gas Sensor
25. Molecular Dynamics Analysis of the Degradation of the Strength of a Grain Boundary Due to the Accumulation of Atomic-Scale Defects
26. Molecular Dynamics Analysis of the Mechanism of Grain Boundary Cracking of a Copper Bicrystal by Defect Accumulation
27. First-principles analysis of dominant structural factors on the strain dependence of the electronic density state of dumbbell shape graphene nanoribbon
28. Molecular Dynamics Analysis of the Criteria of the Change of the Fracture Mode from Transgranular to Intergranular in a Bicrystal Structure of Copper
29. Damage Mechanism of the Acceleration of Intergranular Cracking of Stainless Steel SUS316LN under Creep Loading at Elevated Temperature
30. Dominant factors of the local stress distribution around the fine bump structure in 3D Semiconductor modules
31. Molecular Dynamics Analysis on the Intergranular Cracking Mechanism of Ni-base Superalloy due to the Accumulation of Vacancies around a Grain Boundary
32. Degradation Mechanism of the Strength of a Grain Boundary of Ni-Base Superalloy Alloy 617 under Creep Loading at Elevated Temperature
33. Development of Transfer Process of Graphene Sheet on a Soft Substrate for Strain-controlled Highly Sensitive Gas Sensors
34. Mechanism of Grain Boundary Cracking in Ni-base Superalloy Alloy 617 under Creep Loading at Elevated Temperatures
35. Quantitative Evaluation of the initial intergranular Cracking of Ni-based Superalloys under Creep-fatigue loadings at Elevated Temperatures
36. Development of a Highly-Sensitive Graphene-based Multi-Gas Detecting Sensor by Applying the Strain Dependence of Their Adsorption Behavior
37. Non-destructive Measurement of the Change of Micro Texture of Alloys Using Reflectance Spectrum Analysis of Visible lights
38. Development of a Photovoltaic Device with Plural Band Gaps using Graphene Nanoribbons
39. Graphene Sheet-Base Highly Sensitive Pressure Sensor Using Area-Arrayed Pillar Structure
40. Development of a Strain Sensor for Measuring the Strain Distribution in the 3D Electronic Packages
41. Initial Damage Mechanism of Nickel-Based Alloy 625 Under Creep Loadings at Elevated Temperatures
42. Evaluation of the degradation of the crystallinity of Ni-base superalloy using reflectance spectrum of visible light
43. Basic study on the crystallinity dependence of the strength of polycrystalline material
44. Development of a Strain Sensor for Measuring the Residual Strain Distribution and Its Application to Highly Reliable Semiconductor Devices
45. Degradation of the Strength of a Grain Boundary in Ni-Base Superalloy under High Stress at Elevated Temperature
46. Molecular Dynamics Analysis of the Effect of Crystallographic Orientation on the Strength of a Grain Boundary in a Bicrystal Structure of Copper
47. Degradation of the Strength of Grain Boundaries in Ni-base Superalloy Alloy617 Under Creep-Fatigue Loading at Elevated Temperatures
48. Grain Boundary Cracking in Ni-base Alloy 617 Under Creep-fatigue Loading at Elevated Temperatures
49. Microtexture Dependence of Mechanical Damage Mechanism of Electroplated Gold Thin Film Used for Semiconductor Device Interconnections
50. Grain Boundary Cracking Mechanism in Ni-base Alloy 617 Under Creep-fatigue Loading at Elevated Temperatures
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