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6 results on '"YuQing Jiao"'

1. Towards 1.6T datacentre interconnect technologies: the TWILIGHT perspective

Author

Kevin A. Williams, Nicola Calabretta, Hercules Avramopoulos, Giannis Kanakis, Agnieszka Konczykowska, Oskars Ozolins, M. Spyropoulou, Ripalta Stabile, Yuqing Jiao, Jakub Zve{ě}řina, Jean-Yves Dupuy, Giannis Patronas, Richard Schatz, Paraskevas Bakopoulos, Martin Žoldák, Photonic Integration, Low Latency Interconnect Networks, Electro-Optical Communication, and EAISI High Tech Systems

Subjects
Wafer-scale bonding, Interconnection, Twilight, Computer science, business.industry, Emerging technologies, 020208 electrical & electronic engineering, Perspective (graphical), 02 engineering and technology, Optical space switches, Atomic and Molecular Physics, and Optics, Electronic, Optical and Magnetic Materials, 020210 optoelectronics & photonics, Co-packaged optics, Work (electrical), Optical transceivers, 0202 electrical engineering, electronic engineering, information engineering, Photonic integration, Electrical and Electronic Engineering, Telecommunications, business
Abstract

The transformation of datacentres to support the increasing traffic growth requires the development of new technologies to migrate to 1.6T optical transceivers and to ultra-fast high radix optical space switches. In this work, an outline of the technological perspectives of TWILIGHT project is provided in accordance with research updates and industry standards.

Published
2020
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2. An introduction to InP-based generic integration technology

Author

Norbert Grote, V Valentina Moskalenko, Dominik Heiss, P. I. Kuindersma, Antonio Corradi, Josselin Pello, Francisco M. Soares, E Emil Kleijn, Jos J. G. M. van der Tol, E Elton Bitincka, K Katarzyna Lawniczuk, Barry Smalbrugge, Huub Ambrosius, Adrian Wonfor, Dominic F. G. Gallagher, Yuqing Jiao, Weiming Yao, DO Dzmitry Dzibrou, Daniele Melati, Richard V. Penty, E.J. Geluk, Srivathsa Bhat, Giovanni Gilardi, Andrew Dabbs, D. D'Agostino, MK Meint Smit, Helene Debregeas, D.J. Robbins, Kevin A. Williams, LM Luc Augustin, MJ Michael Wale, Tjibbe de Vries, Andrea Melloni, Stanislaw Stopinski, Jean-Louis Gentner, Paul Firth, Mohand Achouche, M. Felicetti, Erwin Bente, Jeroen Bolk, Francesco Morichetti, Bob Musk, Arjen Bakker, Saeed Tahvili, René van Veldhoven, Jing Zhao, Twan Korthorst, Martin Schell, RG Ronald Broeke, Gunther Roelkens, Rui Santos, Patty Stabile, P. J. A. Thijs, Xaveer Leijtens, Hadi Rabbani, Wonfor, Adrian [0000-0003-2219-7900], Penty, Richard [0000-0003-4605-1455], Apollo - University of Cambridge Repository, Photonic Integration, NanoLab@TU/e, Photonics and Semiconductor Nanophysics, Electro-Optical Communication, and Low Latency Interconnect Networks

Subjects
Single chip, Computer science, business.industry, Photonic integrated circuit, InP, generic foundry, photonic IC, photonic integration, TEL, Condensed Matter Physics, Electronic, Optical and Magnetic Materials, Computer architecture, photonic integration, TEL, Materials Chemistry, Microelectronics, Electrical and Electronic Engineering, Photonics, business, Throughput (business), Electronic circuit
Abstract

Photonic integrated circuits (PICs) are considered as the way to make photonic systems or subsystems cheap and ubiquitous. PICs still are several orders of magnitude more expensive than their microelectronic counterparts, which has restricted their application to a few niche markets. Recently, a novel approach in photonic integration is emerging which will reduce the R&D and prototyping costs and the throughput time of PICs by more than an order of magnitude. It will bring the application of PICs that integrate complex and advanced photonic functionality on a single chip within reach for a large number of small and larger companies and initiate a breakthrough in the application of Photonic ICs. The paper explains the concept of generic photonic integration technology using the technology developed by the COBRA research institute of TU Eindhoven as an example, and it describes the current status and prospects of generic InP-based integration technology

Published
2014

3. Area-selective atomic layer deposition of platinum using photosensitive polyimide

Author

Yuqing Jiao, René H. J. Vervuurt, Wilhelmus M. M. Kessels, Ageeth A. Bol, Akhil Sharma, Plasma & Materials Processing, Photonic Integration, Processing of low-dimensional nanomaterials, and Atomic scale processing

Subjects
Materials science, Nucleation, chemistry.chemical_element, Bioengineering, 02 engineering and technology, 010402 general chemistry, 01 natural sciences, law.invention, Atomic layer deposition, law, Monolayer, Polymer chemistry, General Materials Science, Electrical and Electronic Engineering, Mechanical Engineering, General Chemistry, 021001 nanoscience & nanotechnology, 0104 chemical sciences, Chemical engineering, Resist, chemistry, Mechanics of Materials, Photolithography, 0210 nano-technology, Platinum, Layer (electronics), Polyimide
Abstract

Area-selective atomic layer deposition (AS-ALD) of platinum (Pt) was studied using photosensitive polyimide as a masking layer. The polyimide films were prepared by spin-coating and patterned using photolithography. AS-ALD of Pt using poly(methyl-methacrylate) (PMMA) masking layers was used as a reference. The results show that polyimide has excellent selectivity towards the Pt deposition, after 1000 ALD cycles less than a monolayer of Pt is deposited on the polyimide surface. The polyimide film could easily be removed after ALD using a hydrogen plasma, due to a combination of weakening of the polyimide resist during Pt ALD and the catalytic activity of Pt traces on the polyimide surface. Compared to PMMA for AS-ALD of Pt, polyimide has better temperature stability. This resulted in an improved uniformity of the Pt deposits and superior definition of the Pt patterns. In addition, due to the absence of reflow contamination using polyimide the nucleation phase during Pt ALD is drastically shortened. Pt patterns down to 3.5 μm were created with polyimide, a factor of ten smaller than what is possible using PMMA, at the typical Pt ALD processing temperature of 300 °C. Initial experiments indicate that after further optimization of the polyimide process Pt features down to 100 nm should be possible, which makes AS-ALD of Pt using photosensitive polyimide a promising candidate for patterning at the nanoscale.

Published
2016
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4. Vertical and Smooth Single-Step Reactive Ion Etching Process for InP Membrane Waveguides.

Author

Yuqing Jiao, de Vries, Tjibbe, Unger, Ralph-Stephan, Longfei Shen, Ambrosius, Huub, Radu, Calin, Arens, Michael, Smit, Meint, and van der Tol, Jos

Subjects
IONS, OPTICAL waveguides, SURFACE roughness, WAVEGUIDES, PHOTONS
Abstract

In this paper we present a novel single-step RIE process for InP membrane optical waveguide etching. The optimization of the process is focused on the sidewall verticality and surface roughness of the etched profile. Significant improvement on the etched profile is achieved for the first time in a single-step RIE process. Loss measurement on fabricated membrane waveguides etched with the proposed RIE process results in a record low waveguide propagation loss (2.5 dB/cm). [ABSTRACT FROM AUTHOR]

Published
2015
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5. InP membrane micro-ring resonator for generating heralded single photons.

Author

Rakesh Ranjan Kumar, Marina Raevskaia, Vadim Pogoretskii, Yuqing Jiao, and Hon Ki Tsang

Subjects
PHOTONS, RESONATORS, FOUR-wave mixing, PHOTON pairs
Abstract

In this paper, we experimentally verify the antibunching properties of multiple single photons located at distinct optical modes in a quantum frequency comb generated by cavity-enhanced spontaneous four-wave mixing in an InP membrane micro-ring resonator. The experimentally measured single photon conditional self-correlation parameter well below the classical regime (0.5) with the corresponding detector corrected Klyshko efficiency ηk of 3%–4.2%. [ABSTRACT FROM AUTHOR]

Published
2019
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6. Area-selective atomic layer deposition of platinum using photosensitive polyimide.

Author

René H J Vervuurt, Akhil Sharma, Yuqing Jiao, Wilhelmus (Erwin) M M Kessels, and Ageeth A Bol

Subjects
ATOMIC layer deposition, PLATINUM, PHOTOSENSITIVE polyimides, PHOTOLITHOGRAPHY, SPIN coating, CATALYTIC activity
Abstract

Area-selective atomic layer deposition (AS-ALD) of platinum (Pt) was studied using photosensitive polyimide as a masking layer. The polyimide films were prepared by spin-coating and patterned using photolithography. AS-ALD of Pt using poly(methyl-methacrylate) (PMMA) masking layers was used as a reference. The results show that polyimide has excellent selectivity towards the Pt deposition, after 1000 ALD cycles less than a monolayer of Pt is deposited on the polyimide surface. The polyimide film could easily be removed after ALD using a hydrogen plasma, due to a combination of weakening of the polyimide resist during Pt ALD and the catalytic activity of Pt traces on the polyimide surface. Compared to PMMA for AS-ALD of Pt, polyimide has better temperature stability. This resulted in an improved uniformity of the Pt deposits and superior definition of the Pt patterns. In addition, due to the absence of reflow contamination using polyimide the nucleation phase during Pt ALD is drastically shortened. Pt patterns down to 3.5 μm were created with polyimide, a factor of ten smaller than what is possible using PMMA, at the typical Pt ALD processing temperature of 300 °C. Initial experiments indicate that after further optimization of the polyimide process Pt features down to 100 nm should be possible, which makes AS-ALD of Pt using photosensitive polyimide a promising candidate for patterning at the nanoscale. [ABSTRACT FROM AUTHOR]

Published
2016
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