1. Lifetime Improvement of Organic Light Emitting Diodes using LiF Thin Film and UV Glue Encapsulation
- Author
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Shun-Hsi Wang, Yan-Kuin Su, Jian-Ji Huang, Bohr-Ran Huang, Huai-En Hsieh, Mark O. Liu, Yu-Sheng Tsai, Wen-Ray Chen, Ming-Hua Chang, Tsung-Eong Hsieh, and Fuh-Shyang Juang
- Subjects
Fabrication ,Materials science ,Physics and Astronomy (miscellaneous) ,Passivation ,business.industry ,General Engineering ,General Physics and Astronomy ,Lithium fluoride ,Low melting point ,Curing time ,chemistry.chemical_compound ,chemistry ,OLED ,Optoelectronics ,Thin film ,GLUE ,business - Abstract
This work demonstrates the use of lithium fluoride (LiF) as a passivation layer and a newly developed UV glue for encapsulation on the LiF passivation layer to enhance the stability of organic light-emitting devices (OLEDs). Devices with double protective layers showed a 25-fold increase in operational lifetime compared to those without any packaging layers. LiF has a low melting point and insulating characteristics and it can be adapted as both a protective layer and pre-encapsulation film. The newly developed UV glue has a fast curing time of only 6 s and can be directly spin-coated onto the surface of the LiF passivation layer. The LiF thin film plus spin-coated UV glue is a simple packaging method that reduces the fabrication costs of OLEDs.
- Published
- 2008
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