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Your search keyword '"Jordi Carrabina"' showing total 4 results
Start Over Author "Jordi Carrabina" Publisher iop publishing
4 results on '"Jordi Carrabina"'

1. Large-scale fabrication of all-inkjet-printed resistors and WORM memories on flexible polymer films with high yield and stability

Author

Kalyan Yoti Mitra, Ana Alcalde, Reinhard R. Baumann, Eloi Ramon, Carme Martínez-Domingo, Jordi Carrabina, and Enrico Sowade

Subjects
chemistry.chemical_classification, Yield (engineering), Fabrication, Materials science, chemistry, Scale (ratio), law, Nanotechnology, Polymer, Electrical and Electronic Engineering, Resistor, Electronic, Optical and Magnetic Materials, law.invention
Abstract

We report on the development of inkjet-printed thin-film resistors using both organic and inorganic ink formulations. The passive devices were manufactured on flexible polymer substrates in ambient condition without the need for a cleanroom environment or inert atmosphere and at a maximum temperature of 150 °C. By using the same manufacturing process, the rapid electrical sintering (RES) method is demonstrated as effective for the fabrication of inkjet-printed, programmable Write-Once-Read-Many (WORM) memories. Several hundred fully inkjet-printed resistors with different parameters were fabricated and subsequently morphologically and electrically characterized with the aim of obtaining statistically significant data. From a manufacturing process viewpoint, the procedures based on inkjet printing herein described are highly attractive: they do not require high temperatures, low pressures, special atmospheric conditions, and any masks, therefore providing a versatile low-cost approach to fabricate passive electrical components and simple circuits useful for the electronic industry. Printing can be carried out at a sufficiently low temperature to avoid damage to the fabric substrate and these devices can be used in a range of applications requiring flexible and conformal devices from embedded passive filters in PCBs to wearable electronics.

Published
2021

2. Inkjet printed metal insulator semiconductor (MIS) diodes for organic and flexible electronic application

Author

Reinhard R. Baumann, Kalyan Yoti Mitra, Christoph Sternkiker, Carme Martínez-Domingo, Enrico Sowade, Eloi Ramon, Jordi Carrabina, Henrique L. Gomes, and Publica

Subjects
010302 applied physics, Organic electronics, Materials science, business.industry, Plastic Substrate, Insulator (electricity), 02 engineering and technology, Transistors, 021001 nanoscience & nanotechnology, 01 natural sciences, Electronic, Optical and Magnetic Materials, Work Function, Semiconductor, Circuits, Rectification, 0103 physical sciences, Optoelectronics, Electrical and Electronic Engineering, Metal insulator, 0210 nano-technology, business, Forward current, Diode
Abstract

All inkjet printed rectifying diodes based on a metal-insulator-semiconductor (MIS) layer stack are presented. The rectifying properties were optimized by careful selection of the insulator interlayer thickness and the layout structure. The different diode architectures based on the following materials are investigated: (1) silver/ poly (methylmethacrylate-methacrylic acid)/ polytriarylamine/ silver, (2) silver/ polytriarylamine/ poly (methylmethacrylate-methacrylic acid)/ silver, and (3) silver/ poly (methylmethacrylate-methacrylic acid)/ poly-triarylamine/ poly(3,4-ethylenedioxythiophene) poly (styrenesulfonate). The MIS diodes show an averaged rectification ratio of 200 and reasonable forward current density reaching 40 mA cm -2. They are suitable for a number of applications in flexible printed organic electronics. EU [287682]

Published
2017

3. Chip-by-chip configurable interconnection using digital printing techniques.

Author

Mohammad Mashayekhi, Lee Winchester, Mika-Matti Laurila, Matti Mäntysalo, Simon Ogier, Lluís Terés, and Jordi Carrabina

Subjects
DIGITAL printing, ADAPTIVE computing systems, INTEGRATED circuit interconnections, PRINTED electronics, MICROELECTRONICS
Abstract

Printed electronics technologies add new fabrication concepts to the classical set of microelectronic processes. Among these, the use of digital printing techniques such as inkjet permits the deposition of materials on top of preexisting substrates without any mask. This allows individual personalization of electronic circuits. Different proposals have been made to make use of such a property: (1) wiring new metallic layers on top of circuits to build programmable logic array-like circuits, (2) programming OTP ROM like memories, and (3) building inkjet-configurable gate arrays. The capability of building an individual circuit with technological steps simpler than photolithographic ones opens a concept similar to the successful field programmable gate array. Although nowadays the process resolution is still low, it can quickly evolve to higher wiring densities and therefore permit a greater level of transistor integration. In this paper, we propose a new structure to realize the connections only by deposition of conductive dots oriented to optimize the area needed to implement the drop-on-demand (DoD) wiring at circuit level. One important feature of this structure is that it minimizes the amount of printed material required for the connection thereby reducing failures often seen with DoD printing techniques for conductive lines. These structures have been validated by two different DoD technologies: inkjet and superfine jet, and have been compared to mask-based photolithography technology with promising results. [ABSTRACT FROM AUTHOR]

Published
2017
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