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ObjectiveThere is a need for low power, scalable photoelectronic devices and systems for emerging optogenetic needs in neuromodulation. Conventional light emitting diodes (LEDs) are constrained by power and lead-counts necessary for scalability. Organic LEDs (OLEDs) offer an exciting approach to decrease power and lead-counts while achieving high channel counts on thin, flexible substrates that conform to brain surfaces or peripheral neuronal fibers. In this study, we investigate the potential for using OLEDs to modulate neuronal networks cultured in vitro on a transparent microelectrode array (MEA) and subsequently validate neurostimulation in vivo in a transgenic mouse model.ApproachCultured mouse cortical neurons were transfected with light-sensitive opsins such as blue-light sensitive channel-rhodopsin (ChR2) and green-light sensitive chimeric channel-rhodopsin (C1V1tt) and stimulated using blue and green OLEDs (with 455 and 520 nm peak emission spectra respectively) at a power of 1 mW/mm2 under pulsed conditions.Main resultsWe demonstrate neuromodulation and optostimulus-locked, single unit-neuronal activity in neurons expressing stimulating and inhibiting opsins (n=4 MEAs, each with 16 recordable channels). We also validated the optostimulus-locked response in a channel-rhodopsin expressing transgenic mouse model, where at least three isolatable single neuronal cortical units respond to OLED stimulation.SignificanceThe above results indicate the feasibility of generating sufficient luminance from OLEDs to perform neuromodulation both in vitro and in vivo. This opens up the possibility of developing thin, flexible OLED films with multiple stimulation sites that can conform to the shape of the neuronal targets in the brain or the peripheral nervous system. However, stability of these OLEDs under chronic conditions still needs to be carefully assessed with appropriate packaging approaches.

We demonstrate the microassembly of PDMS (polydimethylsiloxane) microfluidics with integrated circuits made in complementary metal-oxide-semiconductor (CMOS) processes. CMOS-sized chips are flip chip bonded to a flexible polyimide printed circuit board (PCB) with commercially available solder paste patterned using a SU-8 epoxy. The average resistance of each flip chip bond is negligible and all connections are electrically isolated. PDMS is attached to the flexible polyimide PCB using a combination of oxygen plasma treatment and chemical bonding with 3-aminopropyltriethoxysilane. The total device has a burst pressure of 175 kPA which is limited by the strength of the flip chip attachment. This technique allows the sensor area of the die to act as the bottom of the microfluidic channel. The SU-8 provides a barrier between the pad ring (electrical interface) and the fluids; post-processing is not required on the CMOS die. This assembly method shows great promise for developing analytic systems which combine the strengths of microelectronics and microfluidics into one device.