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This paper describes the formation of Cu nanofllms on a Ru/Ta-coated wafer using electrochemical atomic layer deposition (E-ALD). The initial steps involved cleaning and oxide removal from the Ru/Ta substrate using ultrahigh vacuum electrochemical system. Auger spectroscopy was used to follow the relative amounts of oxygen, Ru, and Cu on the wafer: as-received, after electrochemical treatment, after ion bombardment, and after Cu deposition. An automated flow cell electrodeposition system was employed to grow Cu nanofllms with up to 200 cycles using surface limited redox replacement (SLRR) reaction. The open-circuit potential was used to follow the exchange of Pb for Cu in the SLRR reaction. Electron probe microanalysis was used to determine the homogeneity of the Cu films. The use of a complexing agent (citrate) greatly improved the homogeneity. Different concentrations of citrate were investigated, containing 2 or 4 mM citrate. Atomic force microscopy images of the Cu films showed the ingress morphology to be the same as the egress when 4mM citrate was used. A prominent Cu(1ll) peak was displayed in the X-ray diffraction pattern for 200 cycles of Cu grown on the Ru/Ta-coated wafer. [ABSTRACT FROM AUTHOR]