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Low temperature atomic layer deposition was used to deposit α-Ga2O3 films, which were subsequently annealed at various temperatures and atmospheres. The α-Ga2O3 phase is stable up to 400 °C, which is also the temperature that yields the most intense and sharpest reflection by x-ray diffraction. Upon annealing at 450 °C and above, the material gradually turns into the more thermodynamically stable ε or β phase. The suitability of the materials for solar-blind photodetector applications has been demonstrated with the best responsivity achieved being 1.2 A W−1 under 240 nm illumination and 10 V bias, for the sample annealed at 400 °C in argon. It is worth noting however that the device performance strongly depends on the annealing conditions, with the device annealed in forming gas behaving poorly. Given that the tested devices have similar microstructure, the discrepancies in device performance are attributed to hydrogen impurities. [ABSTRACT FROM AUTHOR]

Utilising our novel wafer-scale electrochemical porosification approach which proceeds through the top surface by means of nanoscale vertical etching pathways, we have prepared full 2 inch wafers containing alternating solid GaN and nanoporous GaN (NP-GaN) layers that form distributed Bragg reflectors (DBRs), and have regrown InGaN-based light emitting diode (LED) heterostructures on these wafers. The NP-GaN DBR wafer is epi-ready and exhibits a peak reflectance of 95% at 420 nm prior to growth of the LED heterostructure. We observe a 1.8× enhancement in peak intensity of LED electroluminescence from processed devices, and delayed onset of efficiency droop with increased injection current. [ABSTRACT FROM AUTHOR]