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Start Over Author "Yang, L.Y." Publisher institution of engineering & technology
1 results on '"Yang, L.Y."'

1. Improving electrical performance of Cu porous ultra-low k dielectrics single damascene lines.

Author

Yang, L.Y., Zhang, D.H., Li, C.Y., Wu, S.Y., and Foo, P.D.

Subjects
*DIELECTRIC devices, *CAPACITORS, *ELECTRIC conductivity, *BREAKDOWN voltage, *CONDUCTION bands, *ELECTRONICS
Abstract

An additional dielectric barrier layer SiCN was deposited on the sidewalls prior to Ta(N) metal barrier deposition. It was found that the leakage decreased with three to four orders of magnitude and breakdown voltage increased 200% compared with that without SiCN layer after burn-in at 200°C for 40 h. [ABSTRACT FROM AUTHOR]

Published
2004
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