1. Atomic Layer Deposition Plasma-Based Undoped-HfO2 Ferroelectric FETs for Non-Volatile Memory
- Author
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C.-Y. Liao, Yu-Ying Lai, Wei-Shuo Li, Chia-Feng Wu, Min-Hung Lee, Pin-Guang Chen, Kuo-Yu Hsiang, Kuan-Neng Chen, Hao-Tung Chung, Huang-Chung Cheng, and Jun-Dao Luo
- Subjects
Non-volatile memory ,Crystallography ,Atomic layer deposition ,Materials science ,Dopant ,Annealing (metallurgy) ,Phase (matter) ,Orthorhombic crystal system ,Electrical and Electronic Engineering ,Thin film ,Ferroelectricity ,Electronic, Optical and Magnetic Materials - Abstract
A plasma-based undoped-HfO2 FeFET (ferroelectric FET) with non-volatile memory characteristics is demonstrated. Modifying the O2 plasma period in plasma-enhanced atomic layer deposition (PE-ALD) is an effective approach to enhance the remnant polarization ( $\text{P}_{\text {r}}$ ) up to 2P $_{\text {r}} = 25\,\,\mu \text{C}$ /cm2 for the MFM (metal/ferroelectric/metal) structure with ferroelectric undoped-HfO2 thin films, and successful integration is implemented for the FeFET. The appropriate O2 vacancies ( $\text{V}_{\text {o}}^{{2}+}$ ) benefit the formation of the ferroelectric phase since they play the role of dopants and help orthorhombic phase (o-phase) formation during post-metal annealing (PMA). The $\text{V}_{\text {o}}^{{2}+}$ -rich undoped-HfO2 FeFET exhibits a memory window (MW) of 0.5 V, ${5} \times {10}^{{4}}$ switching endurance cycles, and higher than $10^{{4}}$ sec of data retention with $\text{V}_{\text {P/E}} = \pm 5$ V.
- Published
- 2021
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