1. Dual Field Communication Scheme for UHF (860–960 MHz) Gen2 RFID Chip
- Author
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Hee Bok Kang, Bok Gil Choi, Jin-Yong Chung, and Man Young Sung
- Subjects
RF front end ,Materials science ,business.industry ,Electrical engineering ,Insulator (electricity) ,Hardware_PERFORMANCEANDRELIABILITY ,Condensed Matter Physics ,Chip ,Electronic, Optical and Magnetic Materials ,law.invention ,Capacitor ,Ultra high frequency ,CMOS ,Hardware_GENERAL ,Control and Systems Engineering ,law ,Ferroelectric RAM ,Process integration ,Hardware_INTEGRATEDCIRCUITS ,Materials Chemistry ,Ceramics and Composites ,Electrical and Electronic Engineering ,business - Abstract
The proposed UHF Gen2 RFID chip expands its applications to both FFC and NFC through dual field communication scheme with the dual antenna ports. An RF front end circuit with dual field communication antenna ports and the embedded FeRAM technology on the passive UHF Gen2 RFID chip enables the excellent operating performances and the low cost chip for the tag chip applications from the item level to pallet. The metal-ferroelectric-metal (MFM) capacitor, which is the replacement capacitor device for metal-insulator-metal (MIM) or poly-insulator-poly (PIP), is composed of the ferroelectric material as a dielectric insulator. The MFM capacitor is made simultaneously during the FeRAM memory cell process integration without any additional process integration cost. The MFM capacitor of PZT with the thickness of 0.15μm has the high capacitance value of 20–40 fF at unit μm2 area size. The MFM can be stacked over the CMOS layout area, which saves dramatically the capacitor layout area. The MFM capacitor also has th...
- Published
- 2011
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