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3-D integration technologies have been of increasing interest for compact and high-performance system integration and packaging. Through-silicon-via (TSV) is one of the key technologies to enable vertical connections for stacked ICs and silicon packages. In the recent years, the annular via and taped via geometries have been the focus for industry research institutes and has been demonstrated to have lower electrical resistance and better thermal stability. Different TSV physical structures such as cylindrical, tapered, annular are analyzed using the FEM based EM simulator HFSS in this study. In addition to the TSV shape impact on the performance of TSV signal transmission, the effect of substrate conductivity on the signal transmission is investigated in this study.

Power short (PS) bin failure due to Al bridging in bond pad regions originated from Al whisker, caused severe yield loss in advanced technology nodes. A comprehensive study on circuit design impact on Al whisker bridging issue was carried out and it was found that increasing Al metal spacing reduced Al whisker bridging. Furthermore, through optimization of process, the novel Al high power deposition recipe demonstrated that power short failure caused by Al whisker could be completely eliminated. The two proposed solutions provide a guideline to solve Al whisker for more advanced technology nodes.

Imaging techniques allow probes to scan the near-field of objects to get the image of the objects. However, the near-field systems are prone to signal corruption from unwanted multipath signals. As we know, time reversal techniques can overcome the multipath effect in getting the independence of signals. This paper presents a novel method for enhancing the resolution of slots. With the Fresnel-Kirchhoff diffraction formula, a time reversal imaging system is founded to analyze the performance of imaging. The results show the resolution of slots is enhanced by time reversal imaging method.

In this paper, analytical formulas of time reversal electromagnetic wave in periodic metal wire array, based on the equivalent dielectric model of the array, are derived using transmission line method. A sub-wavelength focal spot can be obtained with time reversal electromagnetic wave in the metal wire array. Influence of metal wire radius, metal wire array period and the number of layers on time reversal electromagnetic wave spatial focusing property is discussed.

This article describes the process,establishing the standard parts library by Dynamic Blocks of AutoCAD, And has realized the intellectualization and the parameterization design. Designers do not need to consult the handbook, only through the Dynamic Block selection of standard parts of the specification, then obtain the corresponding graphics, greatly enhanced the efficiency of drawing.

The purpose of this paper is to study the influences of technological, organizational and environmental factors on the acceptance of RFID in China based on the technology-organization-environment framework. The concept of RFID acceptance is defined as a psychological status to intend to use RFID. The data came from a questionnaire survey in China, and 144 samples were analyzed. The analysis shows that environmental context and organizational context have the important influence on the RFID acceptance in Chinese firms. The environmental context includes customer mandate, competition pressure, and RFID vendor support. The Organization context includes IS usage, professionals of IS unit, and firm size. The characteristics of FRID technology itself are not significant for RFID acceptance.

The model of RFID adoption in China is proposed, which includes FRID technology, organization, environment, perceived ease of use, perceived usefulness and the attitude of use. The survey is conducted and the data is analyzed with SEM using AMOS to verify the proposed model. The analysis shows that environmental variable has the most important influence on the RFID adoption. The second is organizational factors. FRID technology itself has the smallest influence for the enterprise to adopt RFID. Among the sub-variables, the top three factors include government support, competitive pressure, and top management support.