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A novel porous micro heat sink system is presented for dissipating high heat flux of electronic devices. Numerical model for the micro heat sink is proposed to describe heat transfer in the metallic wall and liquid flow and heat transfer in the porous wick structure, and it is solved with SIMPLE algorithm as a conjugate problem. The numerical results showed that the heated surface temperature of porous micro heat sink is low at high heat fluxes. Increasing inlet fluid velocity can greatly decrease the temperatures of the heated surface temperature and bottom surface. The temperature of the heated surface can maintain good isothermal characteristic when inlet located in the bottom of micro heat sink.

A capillary pumped loop (CPL) for the cooling of electronic apparatus was presented, and its operation principle and characteristics were analysed. This paper has pointed out the driving mechanism of the interface which is from phase change of fluid in Capillary Pumped Loop (CPL) and Loop Heat Pipe (LHP). A mathematical model has been developed to describe the driving mechanism. According to the theoretical analysis, there will be an effect on the Yang-Laplace equation and the phase change of the interface because of the heat added to the system. The formulas reflecting relations of the real operating capillary radius with the evaporating temperature and the heat density have been developed to quantitatively evaluate the system characteristic. The model will be a newly driving mechanism for all the capillary wick or micro-groovy channel.