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The grounding technology of plane welding is widely used in microwave components, and the grounding defects have a direct influence on the transmission performance of the circuit. In this paper, the three-dimensional electromagnetic simulation software HFSS is used for modeling and simulation, and the shape and performance correlation analysis of plane welding cavity is carried out by adapting orthogonal experiment. The influence mechanism of plane welding process defects on microwave signal transmission performance is explored. The influence mechanism of cavity caused by plane welding on the microwave RF performance is given qualitatively and quantitatively. The results shows that the plane welding cavity at the feed port and under the microstrip line should be avoided as far as possible. In the transmission performance of microwave signal, the change of cavity along Y direction has a greater impact on the insertion loss, and the change of cavity along X direction has a greater impact on the voltage standing wave ratio. The transmission performance of microwave signal will improve with the increase of penetration rate.

Complex operating environmental loads lead to structure deformation of active phased array antennas (APAA), which could finally seriously degrade the electromagnetic performance of antennas. Based on the electromechanical coupling model of APAA, the phase compensation method is applied to recover the electromagnetic performance of the deformed antenna to the ideal performance as much as possible, where the excitation phase adjustment quantity of element is derived, and the application range of the method is discussed. Finally, the effectiveness of the method is verified by experiments on an APAA with $24\times 32$ elements to compensate the effect of typical deformation in the operating environment. The work can provide theoretical basis to guarantee the electromagnetic performance of APAAs in real time.

Microwave modules are widely used in the fields of IOT communication, target tracking, space detection, and other aerospace fields. With the development of high integration, high reliability, high-speed transmission and miniaturization of microwave electronic equipment, the influence of interconnection in microwave modules on signal transmission is gradually significant. In this paper, aiming at the typical coaxial and microstrip interconnect structure in microwave modules, an interval estimation method for the key parameters of the gold ribbon interconnect structure is proposed. Based on the shape function cascade, the characterization model of gold ribbon interconnect considering the structural process variations is established. Then, by using experimental design, factor level optimization and multi-objective optimization method, the key parameters for gold ribbon interconnect structure considering process variation and parameter interaction are calculated. Finally, a new method of the weighted sum constraint is used to estimate the key parameter interval of the process variation of the gold ribbon interconnection structure. The method proposed in this paper can solve the problems of determining the effective regulation space and optimal design direction of the high-performance microwave modules circuit interconnects under the consideration of process and manufacturing conditions.

Microwave circuits and devices are widely used in the fields of communication, detection and chip components, etc. With the increasing demand of high speed, high reliability, miniaturization and integration of microwave electronic devices, the change of interconnection configuration in microwave components will have a significant impact on signal transmission performance. In this paper, a parametric representation model of flexible interconnection point configuration of gold belt in microwave module is established. Based on the parametric representation model, a coupling model is established to correlate the interconnection point configuration with signal transmission performance. This will provide theoretical guidance for engineers in interconnection design and transmission performance control, and ensure the design and service quality of high-performance electronic equipment.