568 results on '"Yamashita T"'
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2. Subtractive Ru Interconnect Enabled by Novel Patterning Solution for EUV Double Patterning and TopVia with Embedded Airgap Integration for Post Cu Interconnect Scaling
3. Design of a Database-Driven Quality Predictor for Painting Systems
4. Pixel Pitch Hybrid Bonding and Three Layer Stacking Technology for BSI Image Sensor
5. Vertical-Transport Nanosheet Technology for CMOS Scaling beyond Lateral-Transport Devices
6. Mushroom-Type phase change memory with projection liner: An array-level demonstration of conductance drift and noise mitigation
7. Multi-trench-gate Cell Concept for Low Voltage Superjunction Power MOSFETs
8. Sub-6V Operation of Split-Gate Type Charge-Trapping Nonvolatile Memory with High-k Trapping and Blocking Layers for High-Speed and HighlyReliable Embedded Flash
9. Impact of Anode-side Defect Generation on Inter-Level TDDB Degradation in Cu/Low-k Damascene Structures
10. Impact of Homogeneously Dispersed Al Nanoclusters by Si-monolayer Insertion into Hf0.5Zr0.5O2 Film on FeFET Memory Array with Tight Threshold Voltage Distribution
11. Full Bottom Dielectric Isolation to Enable Stacked Nanosheet Transistor for Low Power and High Performance Applications
12. Imaging, Modeling and Engineering of Strain in Gate-All-Around Nanosheet Transitors
13. Co-Existence of 87 Mbit/s Quantum and 10 Gbit/s Classical Communications in 37-Core Fiber
14. 13.1 A 1.33Tb 4-bit/Cell 3D-Flash Memory on a 96-Word-Line-Layer Technology
15. Parasitic Resistance Reduction Strategies for Advanced CMOS FinFETs Beyond 7nm
16. Effective Drive Current in Scaled FinFET and NSFET CMOS Inverters
17. Efficiency enhancement of PV cell emulating system in connection mode
18. Reliability and scalability of FinFET split-gate MONOS array with tight Vth distribution for 16/14nm-node embedded flash
19. Characteristics of ultra-thin MEMS mirror device on flexibe substrate
20. Dynamic strain distribution sensor sheet based on ultra-thin PZT/SI array on flexible substrate for bridge monitoring wireless sensor network
21. Spectroscopic characteristics of pulsed arc discharge in high-pressure CO2 up to supercritical phase
22. Investigation of pulsed breakdown characteristics in high-pressure CO2 including supercritical phase under non-uniform electric field
23. Stacked nanosheet gate-all-around transistor to enable scaling beyond FinFET
24. First demonstration of FinFET split-gate MONOS for high-speed and highly-reliable embedded flash in 16/14nm-node and beyond
25. A 7nm FinFET technology featuring EUV patterning and dual strained high mobility channels
26. Air spacer for 10nm FinFET CMOS and beyond
27. FinFET performance with Si:P and Ge:Group-III-Metal metastable contact trench alloys
28. FINFET technology featuring high mobility SiGe channel for 10nm and beyond
29. Ultra-low power and ultra-low voltage devices and circuits for IoT applications
30. Ti and NiPt/Ti liner silicide contacts for advanced technologies
31. Process optimizations for NBTI/PBTI for future replacement metal gate technologies
32. Ultra-thin piezoelectric strain sensor 5 × 5 array integrated on flexible printed circuit for structural health monitoring by 2D dynamic strain sensing
33. Understanding and mitigating High-k induced device width and length dependencies for FinFET replacement metal gate technology
34. Non-contact carrier density measurement of semiconductor wafers by terahertz spectroscopic ellipsometry
35. Novel single p+poly-Si/Hf/SiON gate stack technology on silicon-on-thin-buried-oxide (SOTB) for ultra-low leakage applications
36. Si nanowire CMOS fabricated with minimal deviation from RMG FinFET technology showing record performance
37. A novel ALD SiBCN low-k spacer for parasitic capacitance reduction in FinFETs
38. Estimation of deveropment of pulse creeping discharge over water solution
39. Characteristics of positive pulse ARC dischaege in supercritical carbon dioxide
40. Safeness of a robot arm using ultrasonic motors with high responsiveness and backdrivability
41. FDSOI CMOS devices featuring dual strained channel and thin BOX extendable to the 10nm node
42. Ultra-thin piezoelectric strain sensor 5 ? 5 array integrated on flexible printed circuit for structural health monitoring by 2D dynamic strain sensing.
43. Tunneling currents and reliability of atomic-layer-deposited SiBCN for low-κ spacer dielectrics
44. Comprehensive study of effective current variability and MOSFET parameter correlations in 14nm multi-fin SOI FINFETs
45. Aggressively scaled strained silicon directly on insulator (SSDOI) FinFETs
46. Surface modification of iron thin films into corrosion resistant property by F2 laser
47. Estimation of deveropment of pulse creeping discharge over water solution.
48. Characteristics of positive pulse ARC dischaege in supercritical carbon dioxide.
49. Channel doping impact on FinFETs for 22nm and beyond
50. Light-induced self-written polymeric waveguides for low-cost integration of single-mode devices
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