Author: "Toyosawa, K." / Publisher: ieee - Searchworks@Jio Institute Digital Library Search Results

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Your search keyword '"Toyosawa, K."' showing total 4 results

Start Over Author "Toyosawa, K." Publisher ieee

4 results on '"Toyosawa, K."'

1. Development of high density memory IC package by stacking IC chips.

Author: Nakanishi, H., Maruyama, T., Miyata, K., Ishio, T., Sota, Y., Narai, A., Fukunaga, S., Toyosawa, K., Fujita, K., and Kada, M.
Published: 1995
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2. Development of 0.45 mm thick Ultra-Thin Small Outline Package (UTSOP).

Author: Omi, S., Maruyama, T., Ishio, T., Narai, A., Sota, Y., Toyosawa, K., Fujiita, K., and Maeda, T.
Published: 1994
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3. Development of 0.45-mm thick ultra-thin small outline package.

Author: Omi, S., Maruyama, T., Ishio, T., Narai, A., Sota, Y., Toyosawa, K., Fujita, K., and Maeda, T.
Published: 1995
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4. Development of high density memory IC package by stacking IC chips

Author: Nakanishi, H., primary, Maruyama, T., additional, Miyata, K., additional, Ishio, T., additional, Sota, Y., additional, Narai, A., additional, Fukunaga, S., additional, Toyosawa, K., additional, Fujita, K., additional, and Kada, M., additional
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