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The energy distributions of electrons in gate-all-around (GAA) Si MOSFETs are analyzed using full-band 3-D Monte Carlo (MC) simulations. Excellent agreement is obtained with experimental current–voltage characteristics. For these 24-nm gate length devices, the electron distribution features a smeared energy peak with an extended tail. This extension of the tail results primarily from the Coulomb scattering within the channel. A fraction of electrons that enter the drain retains their energy, resulting in an out-of-equilibrium distribution in the drain region. The simulated density and average energy of the hot electrons correlate well with experimentally observed device degradation. We propose that the interaction of high-energy electrons with hydrogen-passivated phosphorus dopant complexes within the drain may provide an additional pathway for interface-trap formation in these devices. [ABSTRACT FROM AUTHOR]

Semiconductor–insulator interfaces play an important role in the reliability of integrated devices; however, the impact of these interfaces on the physical mechanisms related to single-event effects has not been previously reported. We present experimental data that demonstrate that single-event charge collection can be impacted by changes in interface quality. The experimental data, combined with simulations, show that single-event response may depend on surface recombination at interface defects. The effect depends on strike location and increases with increasing linear energy transfer (LET). Surface recombination can affect single-event charge collection for interfaces with a surface recombination velocity (SRV) of 1000 cm/s and is a dominant charge collection mechanism with SRV $> 10^{5}$ cm/s. [ABSTRACT FROM AUTHOR]

Heavy-ion measurements are used to define a multiply nested sensitive-volume model for a 180-nm static random access memory (SRAM) test structure using the Monte Carlo radiative energy deposition (MRED) tool. We demonstrate that the fundamental assumptions of simple rectangular-parallelepiped (RPP) or integral-RPP models are inappropriate for single-event latchup (SEL) in this test structure, indicating that more advanced modeling is needed. We develop an MRED model that agrees well with latchup data at normal incidence and at roll and tilt angles of 60°. This process should facilitate estimates of SEL cross section and event rates for this and similar technologies in space environments. [ABSTRACT FROM AUTHOR]

Four D flip-flop (DFF) layouts were created from the same schematic in Sandia National Laboratories’ CMOS7 silicon-on-insulator (SOI) process. Single-event upset (SEU) modeling and testing showed an improved response with the use of shallow (not fully bottomed) N-type metal-oxide-semiconductor field-effect transistors (NMOSFETs), extending the size of the drain implant and increasing the critical charge of the transmission gates in the circuit design and layout. This research also shows the importance of correctly modeling nodal capacitance, which is a major factor determining SEU critical charge. Accurate SEU models enable the understanding of the SEU vulnerabilities and how to make the design more robust. [ABSTRACT FROM AUTHOR]

Silicon-on-insulator latch designs and layouts that are robust to multiple-node charge collection are introduced. A general Monte Carlo radiative energy deposition (MRED) approach is used to identify potential single-event susceptibilities associated with different layouts prior to fabrication. MRED is also applied to bound single-event testing responses of standard and dual interlocked cell latch designs. Heavy ion single-event testing results validate new latch designs and demonstrate bounds for standard latch layouts. [ABSTRACT FROM AUTHOR]

A bipolar-transistor-based sensor technique has been used to compare silicon displacement damage from known and unknown neutron energy spectra generated in nuclear reactor and high-energy-density physics environments. The technique has been shown to yield 1-MeV(Si) equivalent neutron fluence measurements comparable to traditional neutron activation dosimetry. This paper significantly extends previous results by evaluating three types of bipolar devices utilized as displacement damage sensors at a nuclear research reactor and at a Pelletron particle accelerator. Ionizing dose effects are compensated for via comparisons with 10-keV X-ray and/or cobalt-60 gamma ray irradiations. Nonionizing energy loss calculations adequately approximate the correlations between particle and device responses and provide evidence for the use of one particle type to screen the sensitivity of the other. [ABSTRACT FROM PUBLISHER]

The capability to characterize the neutron energy spectrum and fluence received by a test object is crucial to understanding the damage effects observed in electronic components. For nuclear research reactors and high energy density physics facilities this can pose exceptional challenges, especially with low level neutron fluences. An ASTM test method for characterizing neutron environments utilizes the 2N2222A transistor as a 1-MeV equivalent neutron fluence sensor and is applicable for environments with 1 \times 10^12 - 1 \times 10^14\,\,1 -MeV(Si)-Eqv.-n/cm2. In this work we seek to extend the range of this test method to lower fluence environments utilizing the 2N1486 transistor. The 2N1486 is shown to be an effective neutron displacement damage sensor as low as 1 \times 10^10\,\,1 -MeV(Si)-Eqv.-n/cm2. [ABSTRACT FROM PUBLISHER]