1. A 1.8 Gb/s/pin 16Tb NAND Flash Memory Multi-Chip Package with F-Chip of Toggle 4.0 Specification for High Performance and High Capacity Storage Systems
- Author
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Seon-Kyoo Lee, Jungdon Ihm, Sunwon Jung, Jin-Yup Lee, Seung-jae Lee, Daehoon Na, Anil Kavala, Tongsung Kim, Tae-Sung Lee, Chi-Weon Yoon, Dae-Woon Kang, Lee Jangwoo, Junha Lee, Eunjin Song, Byung-Hoon Jeong, Byung-Kwan Chun, Dong-Su Jang, Chan-Ho Kim, Dae Seok Byeon, Doo-Il Jung, Hwasuk Cho, Dongku Kang, Jai Hyuk Song, Manjae Yang, Sang-joon Hwang, and Youngmin Jo
- Subjects
Hardware_MEMORYSTRUCTURES ,Computer science ,business.industry ,Bandwidth (signal processing) ,NAND gate ,Chip ,Flash memory ,Built-in self-test ,Hardware_INTEGRATEDCIRCUITS ,Signal integrity ,business ,Throughput (business) ,Computer hardware ,PCI Express - Abstract
A 1.2 V, 1.8 Gb/s/pin 16Tb-NAND flash memory multi-chip package incorporating with 16-dies of 1-Tb NAND flash memory and the 3rd generation F-Chip is proposed. The proposed F-Chip is developed to meet the performance requirements of high capacity storage devices that adopts PCIe Gen 4 host interface for faster data throughput. It is implemented with Toggle 4.0 standard on dual bi-directional transceiver architecture to achieve maximum valid data window on SSD channels. Also, it facilitates training between F-chip and NAND using on chip DLL and BIST to achieve sufficient signal integrity on in-package channel for 1.8Gb/s/pin. This work achieves a 35% improvement in the I/O operational speed performance and a 23% reduction in the I/O power consumption in comparison with the previous generations.
- Published
- 2020