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Synchrotron X-ray microdiffraction has been successfully used to unravel how stresses evolve both in Cu through silicon via (TSV) as well as in silicon surrounding it. These findings have led to much improvements in solving the integration issues (pop-up/bulging of TSV during annealing, silicon delamination/fracture, etc.) as well as enhancing reliability and performance (reducing the “keep-away zone.”) in the microelectronics devices in the last 5 years. However, today's microelectronics world has moved further into smaller and smaller technology nodes including the TSV diameters and pitches. This report will describe some of our most recent findings on the systematic studies of size effects using TSV samples fabricated with all the same fabrication methodology provided by SK Hynix, Inc. with diameters 2μm, 5μm and 8μm. Our investigation showed the smaller the TSV diameters, the stress is not necessary the smaller and thus suggested that such smaller technology could lead to further integration issues and potentially reliability and performance concerns.

In this paper, we propose a promising multi-objective (MO) optimization model for partner selection in a market-oriented dynamic collaboration (DC) platform of Cloud providers (CPs) to minimize the conflicts among providers that may happen when negotiating among providers. The model not only uses their individual information (INI) but also past collaborative relationship information (PRI) for partner selection which is seldom considered in existing approaches. A multi-objective genetic algorithm (MOGA) called MOGA-IC is also proposed to solve the model as the model is NP-hard. The algorithm is developed using two popular MOGAs- NSGAII and SPEA2. The experimental results show that MOGAIC with NSGA-II outperformed the MOGA-IC with SPEA2 in finding useful Pareto optimal solution sets. In addition, other simulation experiments are conducted to verify the effectiveness of the MOGA-IC in terms of satisfactory partner selection and conflicts minimization.