93 results on '"Schuster C"'
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2. Effect of the Orientation of the Array Elements of Uniform Circular Antenna Arrays on Orbital Angular Momentum (OAM) Modes
3. Using Orbital Angular Momentum (OAM) Modes on Multi-Conductor Cables for Crosstalk Mitigation
4. Characterization of Liquid Crystals Using a Temperature-Controlled 60 GHz Resonator
5. Reconfigurable GaN Digital Tx Applying BST Bandpass Filter
6. Characterization and Modeling of Epitaxially Grown BST on a Conducting Oxide Electrode
7. Ferroelectrics for Tunable High-Power Applications
8. Integral equation methods (MoM) in numerical modeling
9. Extension of the Contour Integral Method for the modeling of TE scattering in two-dimensional photonic structures using the duality principle
10. Tunable dielectric delay line phase shifter based on liquid crystal technology for a SPDT in a radiometer calibration scheme at 100 GHz
11. Tunable microwave component technologies for SatCom-platforms
12. Modeling of mutual coupling between coaxial probes in flat metallic casings using the contour integral method
13. Modeling of mutual coupling between coaxial probes in flat metallic casings using the contour integral method.
14. Extensions to the contour integral method for efficient modeling of TM scattering in two-dimensional photonic crystals
15. Applicability of the thin sheet approximation to the analysis of EM emission from coated PCBs
16. Investigation of field coupling into a carbon fiber aircraft fuselage with the method of moments
17. Recent developments of via and return current path modeling
18. Novel multiport probing fixture for high frequency measurements in dense via arrays
19. Bringing Optics Inside the Box: Recent Progress and Future Trends
20. Photovoltaic properties of Si nanostructure based solar cells fabricated on quartz
21. 3D nanofabrication by reverse contact UV nanoimprint lithography
22. Nanoimprinted photonic crystals enhanced light emitters via surface plasmon
23. An Efficient Hybrid Finite-Element Analysis of Multiple Vias Sharing the Same Anti-Pad in an Arbitrarily Shaped Parallel-Plate Pair.
24. Practical Considerations in the Modeling and Characterization of Printed-Circuit Board Wiring
25. Chip-to-chip optical interconnects
26. Leakage Reduction at Architectural Level
27. Terabus: a chip-to-chip parallel optical interconnect
28. Novel multiport probing fixture for high frequency measurements in dense via arrays.
29. Custom-made calibration standards for measurements of multilayer substrates.
30. Numerical and experimental investigations on a metallic fuselage model with apertures.
31. Fast parametric pre-layout analysis of signal integrity for backplane interconnects.
32. Electrical performance of a multiport interposer for measurements of dense via arrays.
33. Effect of via stubs on the TRL calibration technique for measurement of embedded multilayer structures.
34. Crosstalk analysis in high density connector via pin fields for digital backplane applications using a 12-port vector network analyzer.
35. Fast and concurrent simulations for SI, PI, and EMI analysis of multilayer printed circuit boards.
36. Non-uniform currents on vias and their effects in a parallel-plate environment.
37. Multiport measurement and deembedding techniques for crosstalk study in via arrays.
38. Effect of mixed-reference planes on single-ended and differential links in multilayer substrates.
39. Package design and measurement of 10 Gbps laser diode on high-speed silicon optical bench
40. Including Stripline Connections into Network Parameter Based Via Models for Fast Simulation of Interconnects.
41. Extraction of broadband error boxes for microprobes and recessed probe launches for measurement of printed circuit board structures.
42. Differential to common mode conversion due to asymmetric ground via configurations.
43. EM emission of differential signals across connected printed circuit boards in the GHz range.
44. Bandwidth Study of Recessed Probe Launch Variations for Broadband Measurement of Embedded PCB Structures.
45. Analysis and Optimization of the Recessed Probe Launch for High Frequency Measurements of PCB Interconnects.
46. The viability of 25 Gb/s on-board signalling.
47. Simulation of Via Interconnects Using Physics-Based Models and Microwave Network Parameters.
48. Eliminating via-plane coupling using ground vias for high-speed signal transitions.
49. Progress in representation and validation of physics-based via models.
50. Model-to-hardware correlation of physics based via models with the parallel plate impedance included.
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