571 results on '"SUN Rong"'
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2. Effect of Chip Size and Shape on the Thermal Stress and Strain of Sintered Ag Joints During Thermal Cycling
3. Warpage Control Method in Fan-Out Wafer Level Packaging with Rectangular Chips
4. Ablation Behaviour of Photosensitive Materials in Laser Debonding Processes for Advanced Packaging
5. Effects of additive interactions on electroplating profile of IC substrate copper pillars
6. Fabrication of Ultra-thin Conformal EMI Shielding Coatings on SiP Modules by Inkjet Printing Technology
7. A digital image correlation study on the microstructure and strain behavior of electroplated nanotwinned copper as interconnection material
8. Effect of Different Proportions and Powder Sizes of Sn on The Performance of Cu-Sn TLPB Joints
9. The low Dk, Df surface modification of silica filler in the high speed and high frequency applications
10. Complicated-trajectory Compartment EMI Shielding in SiP Modules by Dispensing Technology
11. Effect of Silane Coupling Agent on The Performance of Electrically Conductive Adhesives
12. Carbazole-grafted Polyimide with Enhanced Adhesion to Smooth Copper
13. Enhanced reliability of ultra-thin BME-MLCCs based on low oxygen vacancy by re-oxidation process
14. Accurate Assessment of Young's Modulus of Sintered Ag Joints by Nanoindentation
15. Flexible cellulose fibre/silver fabric for highly efficient and broadband EMI shielding via metal-organic decomposition approach
16. Structural Analysis of Anisotropic Conductive Film for Liquid Crystal Displays and Semiconductor Packaging Applications
17. A Novel UV-curable Modified Epoxy Resin with High Glass Transition Temperature and Comprehensive Properties
18. The Thermal Transient Measurement for the Carbon Fiber-based Thermal Interface Materials in Electronic Packaging Structures
19. Computational and experimental study of a novel L-Cysteine hydrochloride leveler for copper electroplated via fill in redistribution layers
20. Ad/desorption mechanism of amine-terminated polyoxypropylene suppressor in advanced acid copper electroplating
21. Experimental validation of a simple fractional model for viscoelastic behavior of high filled polymer-based composites
22. Effect of Zr4+ doping on electrical property of BaTiO3-based MLCC with high-voltage
23. A Single-layer Photosensitive Polymer Material for Temporary Bonding and Laser Debonding
24. Warpage behavior of the flip chip package in underfill curing process: in situ characterization and numerical simulation
25. The Effect of Silane Coupling Agent on Viscosity and Mechanical Properties of TIM1
26. An investigation on the on dielectric, ferroelectric properties and failure mechanism for the 0805X7R multi-layer ceramic capacitor
27. A Comprehensive Study on Signal Integrity of Build-up Film Applied to IC Substrate
28. In-situ observation of microscale crack-tip strain field evolution in underfill with different toughening agents via SEM-DIC coupled method
29. Prospective application of nanotwinned copper for Damascene via filling and hybrid bonding
30. Dielectric properties and reliability of calcium-doped BaTiO3-based MLCCs with high capacitance
31. Key Factors for the Formation of Intermetallic Compound During Cu-Sn TLPB Process
32. Investigation on Silver Nanowire/Resin-Induced Liquid Crystal Polymer Metallization
33. Effect of Young’s modulus on the reliability of sintered silver joints: simulation and experiment
34. Silver@Expanded Microspheres/Silicone Conductive Composites with Ultra-low Compression Stress for Electromagnetic Interference Shielding in Electronic Packaging
35. Study on the effects of surface hydroxyl of silica fillers on the mechanical properties of underfills
36. Contribution of sintering process to the reliability of X7R BME-MLCCs with high-voltage
37. The Densification Behavior and Microwave Dielectric Properties of the CBS Glass-ceramics for LTCC Application
38. Improving the interface bonding strength of epoxy adhesives for electronic packaging
39. Improved Dielectric Constant and Breakdown Strength of Polyimide with Cyclohexane End Group via Molecular Engineering Strategy
40. Copper electroplating of through silicon vias (TSV) using a series of nitrogen-containing heterocyclic compounds
41. Effect of Filler Particle Size and Surface Functionalization on the Properties of Thermal Grease
42. Effect of dimension and defects on the flexibility of ultra-thin chips for wearable electronics
43. Regulation of Robot Manipulators in Joint Space via Vector Control Lyapunov Function Approach
44. Rapid Formation of High-Strength Sintered Silver Joints with High Reliability
45. Conditional anonymous remote healthcare data sharing over blockchain
46. VDCOL link optimization of HVDC system based on improved genetic algorithm
47. Predicting effective thermal conductivity of thermal interface materials using machine learning
48. Stretchable and Highly Conductive AgNPs/SBS Film with Wrinkled Ag Layer for Electromagnetic Interference Shielding
49. Stress Analysis of Typical Structure of Redistribution Layer of Fan-Out Wafer Level Package
50. Controllable assembly of a new VO2@hBN-epoxy thermal interface materrial
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